Studies of the Thermal Conductivity and Thermal Resistance of Solder Layers with Lead-Free Pastes by the Photodeflection Method

The processes of heat removal from multijunction solar cells on a germanium substrate to AlN ceramics through a solder layer were studied by thermal wave photodeflection methods. Two types lead-free solder based on SnBi and SnAgCu were used under various pressure soldering conditions. The thermal co...

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Bibliographic Details
Published in:	Technical physics letters Vol. 49; no. 12; pp. 265 - 268
Main Authors:	Glazov, A. L., Kalinovskii, V. S., Kontrosh, E. V., Muratikov, K. L.
Format:	Journal Article
Language:	English
Published:	Moscow Pleiades Publishing 01-12-2023 Springer Nature B.V
Subjects:	Classical and Continuum Physics Germanium Heat transfer Lead free Pastes Photovoltaic cells Physics Physics and Astronomy Solar cells Soldering Solders Substrates Thermal conductivity Thermal resistance thermal resistance thermal waves multi-junction solar cells lead-free solder non-destructive testing
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Summary:	The processes of heat removal from multijunction solar cells on a germanium substrate to AlN ceramics through a solder layer were studied by thermal wave photodeflection methods. Two types lead-free solder based on SnBi and SnAgCu were used under various pressure soldering conditions. The thermal conductivity and thermal resistance of the solder layers are compared. It is shown that the thermal conductivities of the solder layers differ from the reference data for the corresponding metal alloys, and in some cases may depend on the pressure during the brazing process.
ISSN:	1063-7850 1090-6533
DOI:	10.1134/S1063785023900200