Lead-free implementation: Reliability, alloy development, and new technology

Lead-free implementation: Reliability, alloy development, and new technology

In light of these regulations and the want of technical information on leadfree solders, the Electronic Packaging and Interconnection Materials Committee of the TMS Electronic, Magnetic & Photonic Materials Division organized a series of symposia on lead-free and lead-bearing solders in the past...

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Bibliographic Details
Published in:JOM (1989) Vol. 58; no. 6; p. 56
Main Author: Chada, Srinivas
Format: Journal Article
Language:English
Published: New York Springer Nature B.V 01-06-2006
Subjects:
Alloys
Bans
Electrical equipment
Electronic waste
Hazardous materials
Lead free solders
Shear strength
Technology
United States > US
Online Access:Get full text
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Summary:In light of these regulations and the want of technical information on leadfree solders, the Electronic Packaging and Interconnection Materials Committee of the TMS Electronic, Magnetic & Photonic Materials Division organized a series of symposia on lead-free and lead-bearing solders in the past few years.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:1047-4838
1543-1851
DOI:10.1007/s11837-006-0183-9