Heat transfer characteristics of high heat flux vapor chamber

• Published in: Frontiers in Energy Vol. 4; no. 2; p. 166
• Main Authors: Mo, Dongchuan, Lu, Shushen, Zheng, Haoliang, Chin, Chite
• Format: Journal Article
• Language: English
• Published: Dordrecht Springer Nature B.V 01-06-2010
• Subjects: Cooling; Copper; Design engineering; Electronics; Heat transfer; Studies; Temperature; Temperature effects; Test systems; Thermocouples; China
• ISSN: 2095-1701; 2095-1698
• DOI: 10.1007/s11708-009-0076-z

To meet the challenge of heat spreading in electronic products, highly efficient high heat flux heat transfer vapor chambers have been manufactured and their heat transfer characteristics have been studied by a fast test system. A solid copper block with the same shape as the vapor chamber is used to compare the performance of the vapor chamber. The result shows that, it will take about 5 min to achieve a steady state in the fast test system. The heat transfer characteristics of the vapor chamber are more superior to those of the copper block. In this paper, total thermal resistance of the test system is used to evaluate the heat transfer characteristics of the vapor chamber, because it has already been used to consider both the spreading thermal resistance and the flatness of the vapor chamber. [PUBLICATION ABSTRACT]