A road map to ARPA involvement in electronic packaging

The application of advanced electronic packaging and interconnect (EP/I) technology by US Department of Defense's Advance Research Projects Agency are discussed. The EP/I domain includes packages, multichip modules (MCMs), connectors, printed circuit boards (PCBs), boxes, backplanes, and cages....

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Bibliographic Details
Published in:	Computer (Long Beach, Calif.) Vol. 26; no. 4; pp. 82 - 86
Main Author:	Glasser, L.A.
Format:	Journal Article
Language:	English
Published:	IEEE 01-04-1993
Subjects:	Backplanes Connectors Electronics packaging Information technology Integrated circuit interconnections Multichip modules Printed circuits Roads Superconductivity Transmission line matrix methods
Online Access:	Get full text
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Summary:	The application of advanced electronic packaging and interconnect (EP/I) technology by US Department of Defense's Advance Research Projects Agency are discussed. The EP/I domain includes packages, multichip modules (MCMs), connectors, printed circuit boards (PCBs), boxes, backplanes, and cages. The EP/I physical technologies, including diamond substrates, superconductors, and metal matrix packages, are discussed, and information technologies are described.< >
Bibliography:	ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23
ISSN:	0018-9162 1558-0814
DOI:	10.1109/2.206520