Leveraging Atomistic Modeling during Precursor Design for Cobalt Film Deposition
Atomic Layer Deposition (ALD) is used to fabricate ultrathin and conformal thin film structures for many semiconductor and thin film device applications. ALD is particularly advantageous for integrated circuit manufacturing which requires control of film structure in the nanometer or sub-nanometer s...
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Published in: | Computer Aided Chemical Engineering Vol. 44; pp. 157 - 162 |
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Main Authors: | , , , |
Format: | Book Chapter |
Language: | English |
Published: |
2018
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Subjects: | |
Online Access: | Get full text |
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