Filter and Grounding Solutions for Limiting Radiated Emission of a PCB with an Attached UTP Cable

• Published in: IEEE electromagnetic compatibility magazine Vol. 10; no. 1; pp. 33 - 40
• Main Authors: Caniggia, S., Maradei, F.
• Format: Journal Article Magazine Article
• Language: English
• Published: New York IEEE 01-01-2021; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Capacitors; Emission analysis; Emissions; Emissions control; Equivalent circuits; Filtering; Grounding; Integrated circuit modeling; Numerical models; Predictive models; printed circuit board (PCB); radiated emission; SPICE; Three-dimensional displays; Unshielded twisted pair (UTP)
• ISSN: 2162-2264; 2162-2272
• DOI: 10.1109/MEMC.2021.9400990

This paper provides a methodological approach for predicting the radiated emission from a PCB with an attached UTP cable, supported by simulations. First, the sources of emission are analyzed and simple equivalent circuits for SPICE simulations are provided. The concept of filtering and grounding for emission reduction are introduced and a discussion on how to use them in practice is provided. Second, 3D numerical software is used to quantify the effectiveness of several fixes for an isolated PCB located in a metallic enclosure or with a chassis.