Verifying thermal/thermo-mechanical behavior of a 3D stack - challenges and solutions

• Published in: Proceedings of 2010 International Symposium on VLSI Design, Automation and Test pp. 15 - 16
• Main Authors: Marchal, Paul, Van der Plas, Geert, Limaye, Paresh, Mercha, Abdelkarim, Cherman, Vladimir, O'Prins, Herman, Labie, Riet, Vandevelde, Bart, Travaly, Youssef, Beyne, Eric
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01-04-2010
• Subjects: Costs; Packaging; Power dissipation; Random access memory; Temperature measurement; Thermal management; Thermal stresses; Thermomechanical processes; Threshold voltage; Through-silicon vias
• ISBN: 9781424452699; 1424452694
• DOI: 10.1109/VDAT.2010.5496679

The paper describes the design challenges for a low-cost 3D Cu-TSV technology. Based on experimental characterization, we'll indicate the importance of thermal and thermo-mechanical challenges. To avoid related yield loss and/or reliability issues, thermo-mechanical and thermal hotspots should be re-solved in early phases of the design flow. We will present a possible design flow hereto based on the concept of "smart mechanical samples".