Design of The Kinetic Inductance Detector Based Focal Plane Assembly for The Terahertz Intensity Mapper
We report on the kinetic inductance detector (KID) array focal plane assembly design for the Terahertz Intensity Mapper (TIM). Each of the 2 arrays consists of 4 wafer-sized dies (quadrants), and the overall assembly must satisfy thermal and mechanical requirements, while maintaining high optical ef...
Saved in:
Main Authors: | , , , , , , , , , , , , , , , , , , |
---|---|
Format: | Journal Article |
Language: | English |
Published: |
24-07-2024
|
Subjects: | |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | We report on the kinetic inductance detector (KID) array focal plane assembly
design for the Terahertz Intensity Mapper (TIM). Each of the 2 arrays consists
of 4 wafer-sized dies (quadrants), and the overall assembly must satisfy
thermal and mechanical requirements, while maintaining high optical efficiency
and a suitable electromagnetic environment for the KIDs. In particular, our
design manages to strictly maintain a 50 $\mathrm{\mu m}$ air gap between the
array and the horn block. We have prototyped and are now testing a sub-scale
assembly which houses a single quadrant for characterization before integration
into the full array. The initial test result shows a $>$95% yield, indicating a
good performance of our TIM detector packaging design. |
---|---|
DOI: | 10.48550/arxiv.2211.09351 |