Discrete element modelling of deep penetration in granular soils

• Published in: International journal for numerical and analytical methods in geomechanics Vol. 30; no. 4; pp. 335 - 361
• Main Authors: Jiang, M. J., Yu, H.-S., Harris, D.
• Format: Journal Article
• Language: English
• Published: Chichester, UK John Wiley & Sons, Ltd 10-04-2006; Wiley
• Subjects: Applied sciences; Buildings. Public works; discrete element methods; Exact sciences and technology; Geotechnics; granular soils; penetration mechanisms; penetration tests; Soil investigations. Testing; soil-penetrometer interface friction; granular soils; Stress strain relation; penetration mechanisms; Penetration test; discrete element methods; Discrete element method; Modeling; Penetrometer; penetration tests; soil-penetrometer interface friction; Granular material; Soil test; Numerical simulation
• ISSN: 0363-9061; 1096-9853
• DOI: 10.1002/nag.473

This paper presents a numerical study on deep penetration mechanisms in granular materials with the focus on the effect of soil–penetrometer interface friction. A two‐dimensional discrete element method has been used to carry out simulation of deep penetration tests on a granular ground that is under an amplified gravity with a K0 lateral stress boundary. The numerical results show that the deep penetration makes the soil near the penetrometer move in a complex displacement path, undergo an evident loading and unloading process, and a rotation of principal stresses as large as 180°. In addition, the penetration leads to significant changes in displacement and velocity fields as well as the magnitude and direction of stresses. In general, during the whole penetration process, the granular ground undergoes several kinds of failure mechanisms in sequence, and the soil of large deformation may reach a stress state slightly over the strength envelope obtained from conventional compression tests. Soil–penetrometer interface friction has clear effects on the actual penetration mechanisms. Copyright © 2005 John Wiley & Sons, Ltd.