Search Results - "van Silfhout, B."

Chemical–mechanical relationship of amorphous/porous low-dielectric film materials by Yuan, C.A., van der Sluis, O., Zhang, G.Q., Ernst, L.J., van Driel, W.D., van Silfhout, R.B.R., Thijsse, B.J.

“…We have performed a series of atomic simulations, from which the chemical–mechanical relationship of the amorphous/porous silica based low-dielectric (low-k)…”
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Efficient damage sensitivity analysis of advanced Cu/low- k bond pad structures by means of the area release energy criterion by van der Sluis, O., Engelen, R.A.B., van Silfhout, R.B.R., van Driel, W.D., van Gils, M.A.J.

“…For integrated circuit (IC) wafer back-end development, state-of-the-art CMOS-technologies have to be developed and robust bond pad structures have to be…”
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Molecular simulation on the material/interfacial strength of the low-dielectric materials by Yuan, Cadmus A., van der Sluis, Olaf, Zhang, G.Q. (Kouchi), Ernst, Leo J., van Driel, Willem D., van Silfhout, Richard B.R.

“…In this paper, the material stiffness of amorphous/porous low- k material and interfacial strength between amorphous silica and low- k have been simulated by…”
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Virtual qualification of moisture induced failures of advanced packages by van Gils, M.A.J., van Driel, W.D., Zhang, G.Q., Bressers, H.J.L., van Silfhout, R.B.R., Fan, X.J., Janssen, J.H.J.

“…This paper presents a combined numerical and experimental methodology for predicting and preventing moisture induced failures in encapsulated packages…”
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Reliability of wirebonds in micro-electronic packages by van Driel, W.D, van Silfhout, R.B.R, Zhang, G.Q

“…Purpose - At present, over 95 percent of the manufactured packages are still being wire bonded. Owing to the ongoing trend of miniaturization, material…”
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Molecular simulation strategy for mechanical modeling of amorphous/porous low-dielectric constant materials by Yuan, Cadmus A., van der Sluis, Olaf, Zhang, G. Q., Ernst, Leo J., van Driel, Willem D., Flower, Amy E., van Silfhout, Richard B. R.

“…We propose an amorphous/porous molecular connection network generation algorithm for simulating the material stiffness of a low- k material (SiOC:H). Based on…”
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Prediction of Delamination Related IC & Packaging Reliability Problems by van Driel, W.D., van Gils, M.A.J., van Silfhout, R.B.R., Zhang, G.Q.

“…This paper presents our effort to predict delamination related IC & packaging reliability problems. These reliability problems are driven by the mismatch…”
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Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods by van Driel, W.D., Liu, C.J., Zhang, G.Q., Janssen, J.H.J., van Silfhout, R.B.R., van Gils, M.A.J., Ernst, L.J.

“…Interfacial delamination is an often-observed failure mode in multi-layered IC packaging structures, which will not only influence the yield of wafer…”
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Prediction of crack growth in IC passivation layers by He, Y.T., van Gils, M.A.J., van Driel, W.D., Zhang, G.Q., van Silfhout, R.B.R., Ernst, L.J.

“…The aluminium interconnect structures of ICs consists of materials with a large difference in the coefficient of thermal expansion (CTE). The IC backend and…”
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Delamination modeling of three-dimensional microelectronic systems by van der Sluis, O., Timmermans, P.H.M., van Silfhout, R.B.R., van Driel, W.D., Zhang, G.Q.

“…Thermo-mechanical reliability issues are major bottlenecks in the development of future microelectronic components. Numerical modeling can provide more…”
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A numerical method for efficient failure modelling of three-dimensional bond pad structures by van der Sluis, O., van Silfhout, R.B.R., Engelen, R.A.B., van Driel, W.D., Zhang, G.Q., Ernst, L.J.

“…Thermo-mechanical reliability issues are major bottlenecks in the development of future microelectronic components. This is caused by the following technology…”
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Prediction of back-end process-induced wafer warpage and experimental verification by van Silfhout, R.B.R., van Driel, W.D., Li, Y., Zhang, G.Q., Ernst, L.J.

“…During the back-end processes of wafer manufacturing, wafer warpage occurs due to the mismatch in thermal expansion coefficients of the various applied…”
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On Wire Failures in Microelectronic Packages by van Driel, W.D., van Silfhout, R., Zhang, G.Q.

“…At present, over 95% of the manufactured packages are still being wire-bonded. Due to the ongoing trend of miniaturization, material changes, and cost…”
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