Search Results - "van Grunsven, E.C.E."

Passive and heterogeneous integration towards a Si-based System-in-Package concept by Roozeboom, F., Kemmeren, A.L.A.M., Verhoeven, J.F.C., van den Heuvel, F.C., Klootwijk, J., Kretschman, H., Frič, T., van Grunsven, E.C.E., Bardy, S., Bunel, C., Chevrie, D., LeCornec, F., Ledain, S., Murray, F., Philippe, P.

“…Recently Philips launched their first highly integrated cellular RF-transceiver systems using a new Si-based System-in-Package (SiP) technology. This…”
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Integration of SAW filter on PICS substrate using polymer sealing by Georgel, V., Verjus, F., van Grunsven, E.C.E., Poulichet, P., Chamaly, G.S.

“…This paper presents a technique to integrate a die containing an electro-mechanical component on a passive integration connecting substrate (PICS) using a…”
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A SAW filter integrated on a silicon passive substrate used for system in package by Georgel, V., Verjus, F., van Grunsven, E.C.E., Poulichet, P., Lissorgues, G., Pellet, C., Chamaly, S., Bourouina, T.

“…A packaging method for dies containing an electro-mechanical component on a silicon substrate with a polymer seal ring is described in this paper. A Surface…”
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