Search Results - "van Erps, J"

Refine Results
  1. 1

    Laser ablation of parallel optical interconnect waveguides by Van Steenberge, G., Hendrickx, N., Bosman, E., Van Erps, J., Thienpont, H., Van Daele, P.

    Published in IEEE photonics technology letters (01-05-2006)
    “…Excimer laser ablation is presented as an alternative technology to photolithography for the fabrication of board-level parallel optical interconnect…”
    Get full text
    Journal Article
  2. 2

    High-precision 2-D SM fiber connectors fabricated through deep proton writing by Van Erps, J., Volckaerts, B., van Amerongen, H., Vynck, P., Krajewski, R., Debaes, C., Watte, J., Hermanne, A., Thienpont, H.

    Published in IEEE photonics technology letters (15-05-2006)
    “…High-precision two-dimensional (2-D) fiber alignment modules would offer great benefits for high-density photonic interconnects at the multichip-module level,…”
    Get full text
    Journal Article
  3. 3

    Similarity analyses of chromatographic fingerprints as tools for identification and quality control of green tea by Alaerts, G., Van Erps, J., Pieters, S., Dumarey, M., van Nederkassel, A.M., Goodarzi, M., Smeyers-Verbeke, J., Vander Heyden, Y.

    “…► Evaluation of different similarity analysis parameters on green tea fingerprint profiles. ► Detection of non-genuine samples by similarity colour maps and…”
    Get full text
    Journal Article
  4. 4

    Discrete Out-of-Plane Coupling Components for Printed Circuit Board-Level Optical Interconnections by Van Erps, J., Hendrickx, N., Debaes, C., Van Daele, P., Thienpont, H.

    Published in IEEE photonics technology letters (01-11-2007)
    “…We propose discrete out-of-plane coupling components as a versatile alternative to current approaches used to couple light in and out of the propagation plane…”
    Get full text
    Journal Article
  5. 5
  6. 6

    Hot Embossing of Microoptical Components Prototyped by Deep Proton Writing by Van Erps, J., Wissmann, M., Guttmann, M., Hartmann, M., Mohr, J., Debaes, C., Thienpont, H.

    Published in IEEE photonics technology letters (15-09-2008)
    “…In this letter, we present the replication of out-of-plane coupling microcomponents using hot embossing, through the fabrication of a metal mould by…”
    Get full text
    Journal Article
  7. 7

    Embedded Micromirror Inserts for Optical Printed Circuit Boards by Hendrickx, N., Van Erps, J., Bosman, E., Debaes, C., Thienpont, H., Van Daele, P.

    Published in IEEE photonics technology letters (15-10-2008)
    “…We present the use of an embedded 45 deg micromirror, which is patterned in polymer photoresist using deep proton writing. The micromirror is metallized and…”
    Get full text
    Journal Article
  8. 8

    Resolution Analysis of a Polymethylmethacrylate Tapered Probe in Near-Field Terahertz Imaging by Zhu, B, G. He, Stiens, J, J. Van Erps, Ranson, W, De Tandt, C, Thienpont, H, Vounckx, R

    “…A Polymethylmethacrylate (PMMA) rectangular tapered probe with metal coating on the sides is analyzed as a near-field imaging probe at 100 GHz in Ansoft High…”
    Get full text
    Journal Article
  9. 9

    Laser Ablated Micromirrors for Printed Circuit Board Integrated Optical Interconnections by Hendrickx, N., Van Erps, J., Van Steenberge, G., Thienpont, H., Van Daele, P.

    Published in IEEE photonics technology letters (01-06-2007)
    “…Optical interconnections offer a possible solution to the bandwidth problems associated with future electrical interconnections. Optics has proven its…”
    Get full text
    Journal Article
  10. 10

    Tolerance Analysis for Multilayer Optical Interconnections Integrated on a Printed Circuit Board by Hendrickx, N., Van Erps, J., Van Steenberge, G., Thienpont, H., Van Daele, P.

    Published in Journal of lightwave technology (01-09-2007)
    “…Polymer multilayer optical interconnections have gained interest over the past few years in view of their ability to increase the integration density, increase…”
    Get full text
    Journal Article
  11. 11

    Mass Manufacturable 180 ^-Bend Single-Mode Fiber Socket Using Hole-Assisted Low Bending Loss Fiber by Van Erps, J., Debaes, C., Singh, R., Nasilowski, T., Mergo, P., Wojcik, J., Aerts, T., Terryn, H., Vynck, P., Watte, J., Thienpont, H.

    Published in IEEE photonics technology letters (01-02-2008)
    “…High-efficiency low-cost field-installable 180deg-bend single-mode fiber (SMF) sockets are promising new fiber connector components that can facilitate network…”
    Get full text
    Journal Article
  12. 12

    SPAD arrays and micro-optics: towards a real single photon spectrometer by Finocchiaro, P, Campisi, A, Cosentino, L, Pappalardo, A, Musumeci, F, Privitera, S, Scordino, A, Tudisco, S, Fallica, G, Sanfilippo, D, Mazzillo, M, Piazza, A, Van Erps, J, Van Overmeire, S, Vervaeke, M, Volckaerts, B, Vynck, P, Hermanne, A, Thienpont, H, Lombardo, S, Sciacca, E

    Published in Journal of modern optics (20-01-2007)
    “…This study aims at proving that single photon sensing can be made accessible in the form of cheap off-the-shelf micro-devices with…”
    Get full text
    Journal Article Conference Proceeding
  13. 13
  14. 14
  15. 15
  16. 16
  17. 17

    Ultrathin Optoelectronic Device Packaging in Flexible Carriers by Bosman, E, Missinne, J, Van Hoe, B, Van Steenberge, G, Kalathimekkad, S, Van Erps, J, Milenkov, I, Panajotov, K, Van Gijseghem, T, Dubruel, P, Thienpont, H, Daele, P

    “…This paper presents the development of an advanced packaging technique for commercially available optoelectronic devices. Vertical cavity surface emitting…”
    Get full text
    Journal Article
  18. 18

    Kingella kingae, a rare cause of bacterial meningitis by Van Erps, J, Schmedding, E, Naessens, A, Keymeulen, B

    “…A male adolescent with a history of pharyngitis developed meningitis due to Kingella kingae. This is a Gram-negative coccobacillus belonging to the family of…”
    Get more information
    Journal Article
  19. 19

    Energy-per-Bit Limits in Plasmonic Integrated Photodetectors by Wahl, P., Tanemura, T., Debaes, C., Vermeulen, N., Van Erps, J., Miller, D. A. B., Thienpont, H.

    “…The energy consumption per transmitted bit is becoming a crucial figure of merit for communication channels. In this paper, we study the design tradeoffs in…”
    Get full text
    Journal Article
  20. 20

    Out-of-plane Coupling Structures for Optical Printed Circuit Boards by Hendrickx, N, Van Erps, J, Thienpont, H, Van Daele, P

    “…We present an integrated total internal reflection mirror and pluggable coupler that can be used for out-of-plane coupling in an optical PCB. The coupling…”
    Get full text
    Conference Proceeding