Search Results - "del Alamo, J.A."

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  1. 1

    TEM Observation of Crack- and Pit-Shaped Defects in Electrically Degraded GaN HEMTs by Chowdhury, U., Jimenez, J.L., Lee, C., Beam, E., Saunier, P., Balistreri, T., Seong-Yong Park, Taehun Lee, Wang, J., Kim, M.J., Jungwoo Joh, del Alamo, J.A.

    Published in IEEE electron device letters (01-10-2008)
    “…AlGaN/GaN high-electron mobility transistors stressed under dc bias at various channel temperatures were studied using transmission electron microscopy for…”
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    Journal Article
  2. 2

    Critical Voltage for Electrical Degradation of GaN High-Electron Mobility Transistors by Jungwoo Joh, del Alamo, J.A.

    Published in IEEE electron device letters (01-04-2008)
    “…We have found that there is a critical drain-to-gate voltage beyond which GaN high-electron mobility transistors start to degrade in electrical-stress…”
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    Journal Article
  3. 3

    A physical model for the kink effect in InAlAs/InGaAs HEMTs by Somerville, M.H., Ernst, A., del Alamo, J.A.

    Published in IEEE transactions on electron devices (01-05-2000)
    “…We present a new model for the the kink effect in InAlAs/InGaAs HEMTs. The model suggests that the kink is due to a threshold voltage shift which arises from a…”
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    Journal Article
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    30-nm InAs Pseudomorphic HEMTs on an InP Substrate With a Current-Gain Cutoff Frequency of 628 GHz by Dae-Hyun Kim, del Alamo, J.A.

    Published in IEEE electron device letters (01-08-2008)
    “…We report on InAs pseudomorphic high-electron mobility transistors (PHEMTs) on an InP substrate with record cutoff frequency characteristics. This result was…”
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    Journal Article
  6. 6

    Measurement of Channel Temperature in GaN High-Electron Mobility Transistors by Jungwoo Joh, del Alamo, J.A., Chowdhury, U., Tso-Min Chou, Hua-Quen Tserng, Jimenez, J.L.

    Published in IEEE transactions on electron devices (01-12-2009)
    “…In this paper, a simple and reliable method to estimate the channel temperature of GaN high-electron mobility transistors (HEMTs) is proposed. The technique is…”
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    Journal Article
  7. 7

    Experimental comparison of RF power LDMOSFETs on thin-film SOI and bulk silicon by Fiorenza, J.G., del Alamo, J.A.

    Published in IEEE transactions on electron devices (01-04-2002)
    “…Simultaneously fabricated RF power LDMOSFETs on thin-film SOI and bulk silicon wafers. This work compares their DC current-voltage (I-V), capacitance-voltage…”
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    Journal Article
  8. 8

    A Simple Current Collapse Measurement Technique for GaN High-Electron Mobility Transistors by Joh, J., del Alamo, J.A., Jimenez, J.

    Published in IEEE electron device letters (01-07-2008)
    “…Current collapse in GaN high-electron mobility transistors (HEMTs) is a temporary reduction of drain-current immediately after the application of high voltage…”
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    Journal Article
  9. 9

    A through-wafer interconnect in silicon for RFICs by Wu, J.H., Scholvin, J., del Alamo, J.A.

    Published in IEEE transactions on electron devices (01-11-2004)
    “…In order to minimize ground inductance in RFICs, we have developed a high-aspect ratio, through-wafer interconnect (or substrate via) in silicon that features…”
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    Journal Article
  10. 10

    Lateral and Vertical Scaling of \hbox \hbox\hbox HEMTs for Post-Si-CMOS Logic Applications by Dae-Hyun Kim, del Alamo, J.A.

    Published in IEEE transactions on electron devices (01-10-2008)
    “…In this paper, we have experimentally investigated the impact of lateral and vertical scaling of In 0.7 Ga 0.3 As high-electron-mobility transistors (HEMTs)…”
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    Journal Article
  11. 11

    Carrier-induced change in refractive index of InP, GaAs and InGaAsP by Bennett, B.R., Soref, R.A., Del Alamo, J.A.

    Published in IEEE journal of quantum electronics (01-01-1990)
    “…The change in refractive index Delta n produced by injection of free carriers in InP, GaAs, and InGaAsP is theoretically estimated. Bandfilling (Burstein-Moss…”
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    Journal Article
  12. 12

    Impact of substrate-surface potential on the performance of RF power LDMOSFETs on high-resistivity SOI by Scholvin, J., Fiorenza, J.G., del Alamo, J.A.

    Published in IEEE transactions on electron devices (01-07-2006)
    “…This paper presents an in-depth study of the effects of substrate-surface potential on the RF power performance of laterally diffused MOSFETs (LDMOSFETs)…”
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    Journal Article
  13. 13

    Sub-40 nm SOI V-groove n-MOSFETs by Appenzeller, J., Martel, R., Avouris, Ph, Knoch, J., Scholvin, J., del Alamo, J.A., Rice, P., Solomon, P.

    Published in IEEE electron device letters (01-02-2002)
    “…We present output and transfer characteristics of single-gated, 36 nm, 46 nm and 56 nm channel length SOI MOSFETs with a V-groove design. For the shortest…”
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    Journal Article
  14. 14

    A Faraday cage isolation structure for substrate crosstalk suppression by Wu, J.H., Scholvin, J., del Alamo, J.A., Jenkins, K.A.

    “…We have exploited a recently-developed, through-wafer via technology in silicon to implement a novel Faraday cage scheme for substrate crosstalk suppression in…”
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    Journal Article
  15. 15

    An insulator-lined silicon substrate-via technology with high aspect ratio by Wu, J.H., Scholvin, J., Del Alamo, J.A.

    Published in IEEE transactions on electron devices (01-09-2001)
    “…We have developed a novel high-aspect ratio substrate-via technology in silicon that features a SiN insulator liner. In this technology, the via is completely…”
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  16. 16

    Positive temperature coefficient of impact ionization in strained-Si by Waldron, N.S., Pitera, A.J., Lee, M.L., Fitzgerald, E.A., del Alamo, J.A.

    Published in IEEE transactions on electron devices (01-07-2005)
    “…We have experimentally studied impact ionization (II) in the strained-Si layer of a strained-Si/SiGe heterostructure. Our key finding is that the impact…”
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    Journal Article
  17. 17

    GaN HEMT reliability by del Alamo, J.A., Joh, J.

    Published in Microelectronics and reliability (01-09-2009)
    “…This paper reviews the experimental evidence behind a new failure mechanism recently identified in GaN high-electron mobility transistors subject to electrical…”
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    Journal Article Conference Proceeding
  18. 18

    RF power LDMOSFET on SOI by Fiorenza, J.G., Antoniadis, D.A., del Alamo, J.A.

    Published in IEEE electron device letters (01-03-2001)
    “…We have fabricated a SOI laterally diffused MOSFET that is designed for use in radio frequency power amplifiers for wireless system-on-a-chip applications. The…”
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    Journal Article
  19. 19

    Hydrogen sensitivity of InP HEMTs with WSiN-based gate stack by Mertens, S.D., del Alamo, J.A., Suemitsu, T., Enoki, T.

    Published in IEEE transactions on electron devices (01-03-2005)
    “…We have experimentally investigated the hydrogen sensitivity of InP high-electron mobility transistors (HEMTs) with a WSiN-Ti-Pt-Au gate stack. We have found…”
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    Journal Article
  20. 20

    A metal/polysilicon damascene gate technology for RF power LDMOSFETs by Fiorenza, J.G., Scholvin, J., del Alamo, J.A.

    Published in IEEE electron device letters (01-11-2003)
    “…This letter describes a metal/polysilicon damascene gate technology for RF power LDMOSFETs. We compare the performance of SOI LDMOSFETs with metal/polysilicon…”
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