Search Results - "del Agua Borniquel, J."
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A comparison of arsenic and phosphorus extension by Room Temperature and hot ion implantation for NMOS Si bulk-FinFET at N7 (7nm) technology relevant fin dimensions
Published in 2015 Symposium on VLSI Technology (VLSI Technology) (01-06-2015)“…We compare As and P extension implants for NMOS Si bulk FinFETs with 5nm wide fins. P implanted FinFETs shows improved I ON , +15% with Room Temperature (RT)…”
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Conference Proceeding Journal Article -
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Process control & integration options of RMG technology for aggressively scaled devices
Published in 2012 Symposium on VLSI Technology (VLSIT) (01-06-2012)“…We report on aggressively scaled RMG-HKL devices, with tight low-V T distributions [σ(V Tsat ) ~ 29mV (PMOS), ~ 49mV (NMOS) at L gate ~35nm] achieved through…”
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Conference Proceeding -
3
Sub-10−9 Ω·cm2 contact resistivity on p-SiGe achieved by Ga doping and nanosecond laser activation
Published in 2017 Symposium on VLSI Technology (01-06-2017)“…We report record breaking values for PMOS source drain (S/D) contact resistivity, ρ c <; 10 -9 Ω·cm 2 . These were obtained by shallow Ga ion implantation on…”
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Conference Proceeding -
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Comprehensive study of Ga activation in Si, SiGe and Ge with 5 × 10−10 Ω·cm2 contact resistivity achieved on Ga doped Ge using nanosecond laser activation
Published in 2017 IEEE International Electron Devices Meeting (IEDM) (01-12-2017)“…Ga diffusion and activation in Si, SWGe 0.6 and Ge are studied comprehensively. Optimal Ga activation conditions for Si 0.4 Ge 0.6 and Ge feature a low thermal…”
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Conference Proceeding -
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Fundamental study on the impact of C co-implantation on ultra shallow B juntions
Published in 2009 International Workshop on Junction Technology (01-06-2009)“…In this work, the impact of carbon co-implantation on ultra shallow boron - plasma - doping profiles has been investigated. C is used as a co-implant due to…”
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Conference Proceeding