Search Results - "de Souza, Joel P."
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Diffusion-Controlled Porous Crystalline Silicon Lithium Metal Batteries
Published in iScience (23-10-2020)“…Nanostructured porous silicon materials have recently advanced as hosts for Li-metal plating. However, limitations involve detrimental silicon…”
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Journal Article -
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CMOS-Compatible Self-Aligned In0.53Ga0.47As MOSFETs With Gate Lengths Down to 30 nm
Published in IEEE transactions on electron devices (01-10-2014)“…We demonstrate self-aligned fully-depleted 20-nm-thick In 0.53 Ga 0.47 As-channel MOSFETs using CMOS-compatible device structures and manufacturable process…”
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3
High-Performance In0.7Ga0.3As-Channel MOSFETs With High-κ Gate Dielectrics and α-Si Passivation
Published in IEEE electron device letters (2009)Get full text
Journal Article -
4
Comparison of back interface structure alternatives using two sided optical excitation
Published in 2010 35th IEEE Photovoltaic Specialists Conference (01-06-2010)“…The back interface of a solar cell is an important part of the device structure, providing several important functions: 1) reduces the effective surface…”
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Conference Proceeding -
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Fundamentals, impedance, and performance of solid-state Li-metal microbatteries
Published in Journal of vacuum science & technology. A, Vacuum, surfaces, and films (01-05-2020)“…The authors report novel results toward optimizing the electrochemical performance of high vacuum deposited lithium-based all solid-state thin film…”
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Journal Article -
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CMOS-Compatible Self-Aligned In sub(0.53)Ga sub(0.47)As MOSFETs With Gate Lengths Down to 30 nm
Published in IEEE transactions on electron devices (01-10-2014)“…We demonstrate self-aligned fully-depleted 20-nm-thick In sub(0.53)Ga sub(0.47)As-channe l MOSFETs using CMOS-compatible device structures and manufacturable…”
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Journal Article -
7
High performance cmos bulk technology using direct silicon bond (dsb) mixed crystal orientation substrates
Published in IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest (2005)“…High performance 65-nm technology (L poly =45nm, EOT=1.2nm) bulk CMOS has been demonstrated for the first time on mixed orientation substrates formed by using…”
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Conference Proceeding