Search Results - "Zussman, M P"

Kinetics of copper drift in low-κ polymer interlevel dielectrics by Loke, A.L.S., Wetzel, J.T., Townsend, P.H., Tanabe, T., Vrtis, R.N., Zussman, M.P., Kumar, D., Ryu, C., Wong, S.S.

“…This paper addresses the drift of copper ions (Cu super(+)) in various low-permittivity (low- Kappa ) polymer dielectrics to identify copper barrier…”
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Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling by Zoschke, K., Fischer, T., Topper, M., Fritzsch, T., Ehrmann, O., Itabashi, T., Zussman, M. P., Souter, M., Oppermann, H., Lang, K.

“…Temporary wafer bonding for thin wafer processing is one of the key technologies of 3D system integration. In this context we introduce the polyimide material…”
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Kinetics of copper drift in low-kappa polymer interleveldielectrics by Loke, A L S, Wetzel, J T, Townsend, P H, Tanabe, T, Vrtis, R N, Zussman, M P, Kumar, D, Ryu, C, Wong, S S

“…This paper addresses the drift of copper ions (Cu( )) in various low-permittivity (low-kappa) polymer dielectrics to identify copper barrier requirements for…”
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High temperature bonding solutions enabling thin wafer process and handling on 3D-IC manufacturing by Itabashi, T., Kotani, M., Zussman, M. P., Zoschke, K., Fischer, T., Topper, M., Ishida, H.

“…Most advanced IC devices including packaging and substrates are requiring smart solution for wafer thinning/handling as well as stacking techniques to enhance…”
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Backbone-assisted reactions of polymers: 4. Preparation and structural rearrangement of poly(3-chlorothietane) by Zussman, Melvin P., Tirrell, David A.

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