Copper-Based Nanostructured Coatings for Low-Temperature Brazing Applications

This feasibility study demonstrates the possibility to apply nanostructured filler materials for novel low-temperature brazing applications by exploiting the size-dependent melting behavior of metals and alloys when confined to the nano-scale regime. As an example, a copper-based nanostructured braz...

Full description

Saved in:
Bibliographic Details
Published in:MATERIALS TRANSACTIONS Vol. 56; no. 7; pp. 1015 - 1018
Main Authors: Lehmert, Benjamin, Janczak-Rusch, Jolanta, Pigozzi, Giancarlo, Zuraw, Peter, Mattina, Fabio La, Wojarski, Lukas, Tillmann, Wolfgang, Jeurgens, Lars P. H.
Format: Journal Article
Language:English
Published: Sendai The Japan Institute of Metals and Materials 01-01-2015
Japan Science and Technology Agency
Subjects:
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This feasibility study demonstrates the possibility to apply nanostructured filler materials for novel low-temperature brazing applications by exploiting the size-dependent melting behavior of metals and alloys when confined to the nano-scale regime. As an example, a copper-based nanostructured brazing filler is presented, which allows metal brazing of coated Ti-6Al-4V components at 750°C, much below the bulk melting point of copper (1083°C). The copper-based nanostructured brazing fillers can be produced in the form of coatings and free-standing brazing foils. The nano-confinement of Cu is abrogated after brazing and, consequently, the brazed joints can be operated well above their reduced brazing temperatures.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:1345-9678
1347-5320
DOI:10.2320/matertrans.MI201419