Search Results - "Zubelewicz, A."

A mechanisms-based model for dynamic behavior and fracture of geomaterials by Zubelewicz, A., Rougier, E., Ostoja-Starzewski, M., Knight, E.E., Bradley, C., Viswanathan, H.S.

“…A mechanisms-based fracture model applicable to a broad class of earth and earth-like materials is presented. The key features the model captures are: (1)…”
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The high temperature three point bend testing of proton irradiated 316L stainless steel and Mod 9Cr–1Mo by Maloy, Stuart A., Zubelewicz, A., Romero, T., James, M.R., Sommer, W.F., Dai, Y.

“…The predicted operating conditions for a lead–bismuth eutectic target to be used in an accelerator driven system for the Advanced Fuel Cycle Initiative span a…”
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Metal behavior at extreme loading rates by Zubelewicz, Aleksander

“…At extreme loading rates some metals exhibit behavior that is characteristic of a thermodynamically open system. This openness results from a rapid movement of…”
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Numerical simulation of rock burst processes treated as problems of dynamic instability by Zubelewicz, A., Mr z, Z.

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A new method to study dilatant deformation mechanisms in ductile materials by Zubelewicz, Aleksander

“…This paper presents an unconventional method for examining various kinematically admissible and physically acceptable mechanisms of dilatant deformation in…”
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Micromechanism approach to model creep Fatigue Interaction in Lead-Tin Alloy by Robert, M. P, Zubelewicz, A, Keer, L. M

“…An elasto-viscoplastic constitutive equation is derived for a lead-tin alloy used in the microelectronics industry. This crystalline material exhibits…”
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Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill by Ji Eun Park, Jasiuk, I., Zubelewicz, A.

“…The flip-chip assembly, which is composed of three main components, i.e. chip with C4 interconnects, underfill and substrate, undergoes thermal loading during…”
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Characterizing the failure envelope of a conductive adhesive by Olliff, D., Gaynes, M., Kodnani, R., Zubelewicz, A.

“…The importance of flip chip technology is beginning to grow as the use of such technology is seen to be more and more advantageous. The search for alternatives…”
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Formation of dynamic defect structure in metals subjected to extreme loading conditions by ZUBELEWICZ, Aleksander, MAUDLIN, Paul J, GRAY, George T, ZUREK, Anna K

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Interface Element Modeling of Fracture in Aggregate Composites by Zubelewicz, Aleksander, Ba ant, Zden k P

“…A brittle aggregate composite such as portland cement concrete or mortar is modeled in two dimensions as a system of perfectly rigid particles of various sizes…”
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Constitutive Model with Rotating Active Plane and True Stress by Zubelewicz, Aleksander, Ba ant, Zden k P

“…A novel constitutive model for concrete, which approximately describes the basic known test data on nonlinear triaxial behavior including strain-softening, is…”
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