High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer

High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer

Modern design-conscious products have raised the development of advanced electronic fabricating technologies. These widely used industrial technologies show high compatibility for inorganic materials and capacity for mass production. However, the morphology accuracy is hard to ensure and cracks happ...

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Bibliographic Details
Published in:Micromachines (Basel) Vol. 10; no. 3; p. 160
Main Authors: Wu, Kang, Zhou, Qifeng, Zou, Huaping, Leng, Kangmin, Zeng, Yifan, Wu, Zhigang
Format: Journal Article
Language:English
Published: Switzerland MDPI AG 26-02-2019
MDPI
Subjects:
Adhesion
Circuits
Compatibility
cracks and delamination
Deformation
Design
Digital cameras
Electronics
high precision
Inorganic materials
Interlayers
laminated structures
Lasers
Mass production
Morphology
New technology
phase change
Serpentine
Thermoforming
China
Singapore
high precision
cracks and delamination
laminated structures
phase change
thermoforming
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Summary:Modern design-conscious products have raised the development of advanced electronic fabricating technologies. These widely used industrial technologies show high compatibility for inorganic materials and capacity for mass production. However, the morphology accuracy is hard to ensure and cracks happen easily, which could cause the degradation of device performance and life span. In order to make high precision 3D conformable electronics, a thermal phase-changing adhesion interlayer and modified fabricating processes are used in self-developed equipment. The working principles and influencing factors such as heating time and geometry parameters are studied quantitatively. The accuracy of fabricated patterns is enhanced by this new technology and serpentine designed structures. The delamination or detachment are significantly alleviated. Due to the operation convenience and compatibility with existing materials, the presented fabrication method has great potential for mass production of 3D curved conformable electronics.
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ISSN:2072-666X
2072-666X
DOI:10.3390/mi10030160