Search Results - "Zongxiang, Yao"

Quantitative Correlation between Thermal Cycling and the Microstructures of X100 Pipeline Steel Laser-Welded Joints by Wang, Gang, Wang, Jinzhao, Yin, Limeng, Hu, Huiqin, Yao, Zongxiang

“…Due to the limitations of the energy density and penetration ability of arc welding technology for long-distance pipelines, the deterioration of the…”
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Effects of Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints by Yao, Zongxiang, Jiang, Shan, Yin, Limeng, Ling, Diying, Zhang, Zhongwen, Zhang, Liping

“…In order to discuss the effects of Cu-cored solder with pure Ni coating and joint height on the interfacial microstructure and mechanical properties of joints,…”
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Anti-gravity gradient unique arc behavior in the longitudinal electric magnetic field hybrid tungsten inert gas arc welding by Jian, Luo, Zongxiang, Yao, Keliang, Xue

“…An external magnetic field applied in arc welding process results in electro-magnetic stirring (EMS) welding. The added longitudinal magnetic field (LMF)…”
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Microstructures and properties of Sn–0.3Ag–0.7Cu solder doped with graphene nanosheets by Yin, Limeng, Zhang, Zhongwen, Zuo, Cunguo, Fang, Naiwen, Yao, Zongxiang, Su, Zilong

“…Low silver Sn–0.3Ag–0.7Cu (SAC0307) solders with different amounts of graphene nanosheets (GNSs) prepared by powder metallurgy were used to investigate the…”
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Effect of Ni content on the creep properties of Cu/Sn–0.3Ag–0.7Cu/Cu solder micro-joints by Yao, Zongxiang, Ling, Diying, Yin, Limeng, Wang, Gang, Zhang, Hehe, Jiang, Shan

“…The tensile creep properties of line-type Cu/Sn–0.3Ag–0.7Cu(SAC0307)– x Ni ( x  = 0, 0.02, 0.05 and 0.10 wt%)/Cu solder micro-joints were comparatively…”
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Effects of Graphene Nanosheets on the Wettability and Mechanical Properties of Sn-0.3Ag-0.7Cu Lead-Free Solder by Yin, Limeng, Zhang, Zhongwen, Su, Zilong, Zuo, Cunguo, Yao, Zongxiang, Wang, Gang, Zhang, Hehe, Zhang, Long, Zhang, Yupeng

“…Low silver Sn-0.3Ag-0.7Cu (SAC0307) composite solder reinforced with graphene nanosheets (GNs) was prepared by powder metallurgy techniques, and the effects of…”
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The Evolution and Distribution of Microstructures in High-Energy Laser-Welded X100 Pipeline Steel by Wang, Gang, Yin, Limeng, Yao, Zongxiang, Wang, Jinzhao, Jiang, Shan, Zhang, Zhongwen, Zuo, Cunguo

“…High-energy beam welding was introduced for pipeline steel welding to reduce pipeline construction costs and improve the efficiency and safety of oil and gas…”
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Study on the Corrosion Behaviours of X80 Pipeline Steel Joints Fabricated via Hot-Wire Tungsten Inert Gas Welding by Zongxiang, Yao, Shan, Jiang, Gang, Wang, limeng, Yin, Deping, Jiang, Zhongwen, Zhang

“…X80 pipeline steel joints were fabricated via hot-wire tungsten inert gas welding by using ER70S-G wire with a diameter of 1.2 mm. The microstructures of the…”
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Experimental and numerical simulation of mechanical behavior of micro-scale SAC305 solder joint based on joint height by Yin, Limeng, Zuo, Cunguo, Zhang, Zhongwen, Wang, Gang, Yao, Zongxiang, Su, Zilong, Fang, Naiwen

“…Lead-free “copper wire/Sn-3.0Ag-0.5Cu (SAC305) solder/copper wire” sandwich-structured micro-scale solder joints with a constant diameter ( d  = 400 μm) and…”
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Double-Sided Single-Pass Submerged Arc Welding for 2205 Duplex Stainless Steel by Luo, Jian, Yuan, Yi, Wang, Xiaoming, Yao, Zongxiang

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Phase field simulation of interface evolution behavior of copper-tin micro-solder joints under thermal-mechanical-electrical coupling by Zhang, Long, Guo, Hao, Yin, Limeng, Zhang, Hehe, Yao, Zongxiang

“…The thermal-mechanical-electrical-diffusion strongly coupled equations are established, and the phase field method is employed to investigate the dynamic…”
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Molecular dynamics simulation and experimental study of tin growth in SAC lead-free microsolder joints under thermo-mechanical-electrical coupling by Zhang, Long, Xiong, Dengjie, Su, Zilong, Li, Junfeng, Yin, Limeng, Yao, Zongxiang, Wang, Gang, Zhang, Liping, Zhang, Hehe

“…Sn-Ag-Cu system lead-free solders are considered to be promising solder series. The growth of Sn whiskers on the solder surface is an important factor that…”
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Interfacial microstructure evolution and properties of Sn-0.3Ag-0.7Cu–xSiC solder joints by Yin, Limeng, Zhang, Zhongwen, Su, Zilong, Zhang, Hehe, Zuo, Cunguo, Yao, Zongxiang, Wang, Gang, Zhang, Long, Zhang, Yupeng

“…The impacts of SiC on the wettability, mechanical properties and growth of intermetallic compound (IMC) of the low silver Sn-0.3Ag-0.7Cu (SAC0307) –xSiC…”
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Molecular dynamics simulation of the interfacial evolution and whisker growth of copper-tin coating under electrothermal coupling by Zhang, Long, Xiong, Dengjie, Li, Junfeng, Yin, Limeng, Yao, Zongxiang, Wang, Gang, Zhang, Liping, Zhang, Hehe

“…•Simulate the interfacial evolution of copper-tin coating under electrothermal coupling.•Simulate the whisker growth of copper-tin coating by molecular…”
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Phase Field Simulation of Intermetallic Compound Evolution at the Interface of Copper–Tin Coating Under Thermal–Mechanical–Electrical Diffusion Coupling by Zhang, Long, Li, Junfeng, Yin, Limeng, Zhang, Hehe, Xu, Manru, Yao, Zongxiang

“…The dynamic growth process of intermetallic compounds (IMCs) at the interface of copper–tin coating and the process of microvoid formation were studied using…”
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Effect of multi-walled carbon nanotubes on the microstructure and properties of Sn-58Bi solder alloys by Yao, Zongxiang, Zhang, Yan, Ling, Diying, Yin, Limeng, Wang, Gang, Zhang, Hehe, Zhang, Liping, Zhang, Long

“…The influence of multi-walled carbon nanotube (MWCNT) content on the melting properties, wettability, microstructure, and intermetallic compounds (IMCs) of…”
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Effect of Cu Addition on the Microstructure and Mechanical Properties of Sn-58Bi-0.5Ag Solder Alloys by Yao, Zongxiang, Ling, Diying, Liu, Yikai, Sun, Jiashuai, Yin, Limeng, Wang, Gang, Zhang, Long

“…In this study, the effects of Cu addition to Sn-58Bi-0.5Ag solder were investigated with respect to the alloy properties and fracture behavior of solder…”
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Increasing working temperature span in Ni-Mn-Sn-Co alloys via introducing pores by Zhang, Hehe, Zhang, Xuexi, Qian, Mingfang, Yao, Zongxiang, Wei, Longsha, Geng, Lin

“…[Display omitted] •Ni40.7Mn42.9Sn10.4Co6.0 foam with porosity 56% was created by replication casting and annealing.•The foam had reduced thermal hysteresis…”
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Peculiarity of magnetocaloric and magnetoresistance effects in Ni–Mn–Sn–Fe alloy with successive metamagnetic structural transitions by Zhang, Hehe, Zhang, Xuexi, Xiao, Yuchen, Yang, Man, Xu, Ziqi, Yao, Zongxiang, Qian, Mingfang, Zhang, Liping, Yin, Limeng, Jia, Dongyong

“…Magnetocaloric and magnetoresistance properties originated from a metamagnetic structural transition were investigated in a Fe-doped Ni46.8Mn38.1Sn11.6Fe3.5…”
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Transformation of Laves phases and its effect on the mechanical properties of TIG welded Mg-Al-Ca-Mn alloys by Chai, Sensen, Zhong, Shiyu, Yang, Qingshan, Yu, Daliang, Dai, Qingwei, Zhang, Hehe, Yin, Limeng, Wang, Gang, Yao, Zongxiang

“…•The transformation of Laves phases in heat resistant Mg-Al-Ca-Mn alloys was clarified in details concerning the Ca/Al ratio and welding thermal…”
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