Search Results - "Zhao, Biyao"

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  1. 1

    Mechanism of Random Telegraph Noise in 22-nm FDSOI-Based MOSFET at Cryogenic Temperatures by Ma, Yue, Bi, Jinshun, Wang, Hanbin, Fan, Linjie, Zhao, Biyao, Shen, Lizhi, Liu, Mengxin

    Published in Nanomaterials (Basel, Switzerland) (06-12-2022)
    “…In the emerging process-based transistors, random telegraph noise (RTN) has become a critical reliability problem. However, the conventional method to analyze…”
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    Journal Article
  2. 2

    Improved Ferroelectric Properties in Hf0.5Zr0.5O2 Thin Films by Microwave Annealing by Zhao, Biyao, Yan, Yunting, Bi, Jinshun, Xu, Gaobo, Xu, Yannan, Yang, Xueqin, Fan, Linjie, Liu, Mengxin

    Published in Nanomaterials (Basel, Switzerland) (30-08-2022)
    “…In the doped hafnia(HfO2)-based films, crystallization annealing is indispensable in forming ferroelectric phases. In this paper, we investigate the annealing…”
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    Journal Article
  3. 3

    Modeling and analysis of package PDN for computing system based on cavity model by Jonghyun Cho, Siqi Bai, Biyao Zhao, Ruehli, Albert, Drewniak, James, Cocchini, Matteo, Connor, Samuel, Cracraft, Michael A., Becker, Dale

    “…Recent computing systems consume more than several hundred watts of power and a robust PDN design is critical to minimize power/ground (P/G) voltage…”
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    Conference Proceeding
  4. 4

    A novel z-directed embedded component for the reduction of voltage ripple on the power distribution network for PCBs by Biyao Zhao, Hardin, Keith, Hosseinbeig, Ahmad, Cao, Ying S., Dikhaminjia, Nana, Kratzer, Zach, Fessler, John, Drewniak, James

    “…A new capacitor package and PCB embedding technique is introduced to significantly reduce the system power distribution network impedance at the pads of…”
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    Conference Proceeding
  5. 5

    A novel Z-directed embedded component for the reduction of voltage ripple on the power distribution network for PCBs by Biyao Zhao, Hardin, Keith, Hosseinbeig, Ahmad, Cao, Ying S., Dikhaminjia, Nana, Kratzer, Zach, Fessler, John, Drewniak, James

    “…A new capacitor package and PCB embedding technique is introduced to significantly reduce the system power distribution network impedance at the pads of…”
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    Journal Article Magazine Article
  6. 6

    On finding the optimal number of decoupling capacitors by minimizing the equivalent inductance of the PCB PDN by Shringarpure, Ketan, Biyao Zhao, Leihao Wei, Archambeault, Bruce, Ruehli, Albert, Cracraft, Michael, Cocchini, Matteo, Wheeler, Edward, Jun Fan, Drewniak, James

    “…PCB-PDN design remains a challenge with the reducing noise margins. One aspect of PDN design is finding the number of decoupling capacitors required for each…”
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    Conference Proceeding
  7. 7

    Effect of narrow power fills on PCB PDN noise by Shringarpure, Ketan, Biyao Zhao, Archambeault, Bruce, Ruehli, Albert, Jun Fan, Drewniak, James

    “…The printed circuit board (PCB) power delivery network (PDN) performance has become critical with the reducing margins on power noise. This paper deals with a…”
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    Conference Proceeding
  8. 8

    Cavity model method based with gradient current distribution along the via for power integrity simulation by Hanzhi Ma, Hanbiao Jin, Sichen Yang, Erping Li, Biyao Zhao, Chenxi Huang, Siqi Bai, Ruehli, Albert, Drewniak, James

    “…Cavity model is one of the key computational models for power distribution network simulation. However, the conventional cavity model assumes uniform current…”
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    Conference Proceeding
  9. 9
  10. 10

    Sub-10-nm Air Channel Field Emission Device With Ultra-Low Operating Voltage by Fan, Linjie, Bi, Jinshun, Xi, Kai, Zhao, Biyao, Yang, Xueqin, Xu, Yannan

    Published in IEEE electron device letters (01-09-2021)
    “…In this letter, sub-10-nm air channel devices were fabricated with the aid of photolithography and focused ion beam (FIB) etching. Field emission (FE)…”
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    Journal Article
  11. 11

    Localized Backside Etching Structure of SOI Substrates on Total Ionizing Dose Effect Hardening for RF Applications by Zhao, Biyao, Bi, Jinshun, Ma, Yue, Zhang, Jian, Wang, Yan, Fan, Linjie, Han, Tingting, Stempitsky, Viktor

    Published in IEEE transactions on electron devices (01-05-2022)
    “…In this work, the localized backside etching (LBE) structure is introduced as a strategy for total ionizing dose (TID) irradiation hardening. Immunity to…”
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    Journal Article
  12. 12

    Nanoscale Vacuum Channel Hall Sensors by Fan, Linjie, Bi, Jinshun, Zhao, Biyao, Yan, Gangping, Ma, Yue, Zhao, Fazhan

    Published in IEEE sensors journal (15-12-2022)
    “…Nanoscale vacuum channel Hall sensors were fabricated and simulated. The fabrication flow was compatible with the complementary-metal-oxide-semiconductor…”
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    Journal Article
  13. 13

    Identification and confirmation of novel genetic loci and domestication gene GmGA20ox1 regulating primary root length in soybean seedling stage by Li, Yang, Gu, Jinbao, Zhao, Biyao, Yuan, Jianbo, Li, Cong, Lin, Yan, Chen, Yanhang, Yang, Xiaolan, Li, Yan, Wang, Zhen-Yu

    Published in Industrial crops and products (01-10-2024)
    “…Soybean is one of the major oil and economic crops for human beings, and the adequate root length ensures proper growth, development, stress tolerance, and…”
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    Journal Article
  14. 14

    Identification of the domestication gene GmCYP82C4 underlying the major quantitative trait locus for the seed weight in soybean by Li, Yang, Zhao, Wenqian, Tang, Jiajun, Yue, Xiuli, Gu, Jinbao, Zhao, Biyao, Li, Cong, Chen, Yanhang, Yuan, Jianbo, Lin, Yan, Li, Yan, Kong, Fanjiang, He, Jin, Wang, Dong, Zhao, Tuan-Jie, Wang, Zhen-Yu

    Published in Theoretical and applied genetics (01-03-2024)
    “…Key message A major quantitative trait locus (QTL) for the hundred-seed weight (HSW) was identified and confirmed in the two distinct soybean populations, and…”
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    Journal Article
  15. 15
  16. 16

    System SI/PI Modeling and Analysis by Zhao, Biyao

    Published 01-01-2020
    “…A physics-based circuit modeling methodology for 3D IC/packages is proposed here. The method is based on partial element equivalent circuit (PEEC) and layered…”
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    Dissertation
  17. 17

    The impacts of localized backside etching on proton radiation response in SOI passive devices by Zhao, Biyao, Bi, Jinshun, Ma, Yue, Zhang, Jian, Wang, Yan, Fan, Linjie, Han, Tingting, Xuan, Yundong, Stempitsky, Viktor, Liu, Mengxin

    Published in Japanese Journal of Applied Physics (01-02-2023)
    “…Abstract In this work, the effect of high-energy proton irradiation on the radiofrequency (RF) properties of silicon-on-insulator (SOI) substrates is…”
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    Journal Article
  18. 18

    Physics-Based Circuit Modeling Methodology for System Power Integrity Analysis and Design by Zhao, Biyao, Bai, Siqi, Connor, Samuel, Becker, Wiren Dale, Cocchini, Matteo, Cho, Jonghyun, Ruehli, Albert, Archambeault, Bruce, Drewniak, James L.

    “…A physics-based circuit modeling methodology for system-level power integrity (PI) analysis and design is presented herein. The modeling methodology is based…”
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    Journal Article
  19. 19

    PEEC Modeling in 3D IC/Packaging Applications based on Layered Green's Functions by Zhao, Biyao, Bai, Siqi, Jun, Fan, Achkir, Brice, Ruehli, Albert

    “…A circuit modeling application for 3D IC/packages is proposed in this paper. The method is based on the partial element equivalent circuit (PEEC) method and…”
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    Journal Article
  20. 20

    Analytical PDN voltage ripple calculation using simplified equivalent circuit model of PCB PDN by Biyao Zhao, Chenxi Huang, Shringarpure, Ketan, Jun Fan, Archambeault, Bruce, Achkir, Brice, Connor, Samuel, Cracraft, Michael, Cocchini, Matteo, Ruehli, Albert, Drewniak, James

    “…Printed circuit board (PCB) power distribution network (PDN) design performance depends on the peak voltage ripple caused by the integrated circuit (IC)…”
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    Conference Proceeding