Search Results - "Zhao, Biyao"
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1
Mechanism of Random Telegraph Noise in 22-nm FDSOI-Based MOSFET at Cryogenic Temperatures
Published in Nanomaterials (Basel, Switzerland) (06-12-2022)“…In the emerging process-based transistors, random telegraph noise (RTN) has become a critical reliability problem. However, the conventional method to analyze…”
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Journal Article -
2
Improved Ferroelectric Properties in Hf0.5Zr0.5O2 Thin Films by Microwave Annealing
Published in Nanomaterials (Basel, Switzerland) (30-08-2022)“…In the doped hafnia(HfO2)-based films, crystallization annealing is indispensable in forming ferroelectric phases. In this paper, we investigate the annealing…”
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Journal Article -
3
Modeling and analysis of package PDN for computing system based on cavity model
Published in 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01-08-2017)“…Recent computing systems consume more than several hundred watts of power and a robust PDN design is critical to minimize power/ground (P/G) voltage…”
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Conference Proceeding -
4
A novel z-directed embedded component for the reduction of voltage ripple on the power distribution network for PCBs
Published in 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01-08-2017)“…A new capacitor package and PCB embedding technique is introduced to significantly reduce the system power distribution network impedance at the pads of…”
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Conference Proceeding -
5
A novel Z-directed embedded component for the reduction of voltage ripple on the power distribution network for PCBs
Published in IEEE electromagnetic compatibility magazine (01-01-2017)“…A new capacitor package and PCB embedding technique is introduced to significantly reduce the system power distribution network impedance at the pads of…”
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Journal Article Magazine Article -
6
On finding the optimal number of decoupling capacitors by minimizing the equivalent inductance of the PCB PDN
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01-08-2014)“…PCB-PDN design remains a challenge with the reducing noise margins. One aspect of PDN design is finding the number of decoupling capacitors required for each…”
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Conference Proceeding -
7
Effect of narrow power fills on PCB PDN noise
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01-08-2014)“…The printed circuit board (PCB) power delivery network (PDN) performance has become critical with the reducing margins on power noise. This paper deals with a…”
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Conference Proceeding -
8
Cavity model method based with gradient current distribution along the via for power integrity simulation
Published in 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01-08-2017)“…Cavity model is one of the key computational models for power distribution network simulation. However, the conventional cavity model assumes uniform current…”
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Conference Proceeding -
9
Power integrity with voltage ripple spectrum decomposition for physics-based design
Published in 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01-07-2016)“…A decomposition method for the PCB PDN voltage ripple caused by the IC switching current is developed based on an equivalent circuit model from a cavity model…”
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Conference Proceeding -
10
Sub-10-nm Air Channel Field Emission Device With Ultra-Low Operating Voltage
Published in IEEE electron device letters (01-09-2021)“…In this letter, sub-10-nm air channel devices were fabricated with the aid of photolithography and focused ion beam (FIB) etching. Field emission (FE)…”
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Journal Article -
11
Localized Backside Etching Structure of SOI Substrates on Total Ionizing Dose Effect Hardening for RF Applications
Published in IEEE transactions on electron devices (01-05-2022)“…In this work, the localized backside etching (LBE) structure is introduced as a strategy for total ionizing dose (TID) irradiation hardening. Immunity to…”
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Journal Article -
12
Nanoscale Vacuum Channel Hall Sensors
Published in IEEE sensors journal (15-12-2022)“…Nanoscale vacuum channel Hall sensors were fabricated and simulated. The fabrication flow was compatible with the complementary-metal-oxide-semiconductor…”
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Journal Article -
13
Identification and confirmation of novel genetic loci and domestication gene GmGA20ox1 regulating primary root length in soybean seedling stage
Published in Industrial crops and products (01-10-2024)“…Soybean is one of the major oil and economic crops for human beings, and the adequate root length ensures proper growth, development, stress tolerance, and…”
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Journal Article -
14
Identification of the domestication gene GmCYP82C4 underlying the major quantitative trait locus for the seed weight in soybean
Published in Theoretical and applied genetics (01-03-2024)“…Key message A major quantitative trait locus (QTL) for the hundred-seed weight (HSW) was identified and confirmed in the two distinct soybean populations, and…”
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15
Radiation Immune-Planar Two-Terminal Nanoscale Air Channel Devices toward Space Applications
Published in ACS applied nano materials (08-12-2023)Get full text
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16
System SI/PI Modeling and Analysis
Published 01-01-2020“…A physics-based circuit modeling methodology for 3D IC/packages is proposed here. The method is based on partial element equivalent circuit (PEEC) and layered…”
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Dissertation -
17
The impacts of localized backside etching on proton radiation response in SOI passive devices
Published in Japanese Journal of Applied Physics (01-02-2023)“…Abstract In this work, the effect of high-energy proton irradiation on the radiofrequency (RF) properties of silicon-on-insulator (SOI) substrates is…”
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Journal Article -
18
Physics-Based Circuit Modeling Methodology for System Power Integrity Analysis and Design
Published in IEEE transactions on electromagnetic compatibility (01-08-2020)“…A physics-based circuit modeling methodology for system-level power integrity (PI) analysis and design is presented herein. The modeling methodology is based…”
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Journal Article -
19
PEEC Modeling in 3D IC/Packaging Applications based on Layered Green's Functions
Published in IEEE transactions on signal and power integrity (15-02-2023)“…A circuit modeling application for 3D IC/packages is proposed in this paper. The method is based on the partial element equivalent circuit (PEEC) method and…”
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Journal Article -
20
Analytical PDN voltage ripple calculation using simplified equivalent circuit model of PCB PDN
Published in 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity (01-03-2015)“…Printed circuit board (PCB) power distribution network (PDN) design performance depends on the peak voltage ripple caused by the integrated circuit (IC)…”
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Conference Proceeding