Search Results - "Ze-Kai Hsiau"

Robust, stable, and accurate boundary movement for physical etching and deposition simulation by Ze-Kai Hsiau, Kan, E.C., McVittie, J.P., Dutton, R.W.

“…The increasing complexity of VLSI device interconnect features and fabrication technologies encountered by semiconductor etching and deposition simulation…”
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Heterogeneous process simulation tool integration by Sahul, Z.H., Wang, K.C., Ze-Kai Hsiau, McKenna, E.W., Dutton, R.W.

“…An unified strategy for achieving heterogeneous tool integration within the technology computer-aided design (TCAD) realm is presented. Geometry, grid and…”
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Modeling and characterization of three-dimensional effects in physical etching and deposition simulation by Ze-Kai Hsiau, Kan, E.C., Bang, D.S., McVittie, J.P., Dutton, R.W.

“…With the ever decreasing transistor feature sizes, scaling of interconnect has caused many new challenges in fabrication technology. Three-dimensional (3D)…”
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Boundary movement in semiconductor etching and deposition simulation by Hsiau, Ze-Kai

“…Development of next-generation VLSI with deep sub-micron technologies has drawn a demand for fundamental understanding of wafer fabrication steps and…”
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Boundary movement in semiconductor etching and deposition simulation by Hsiau, Ze-Kai

“…Development of next-generation VLSI with deep sub-micron technologies has drawn a demand for fundamental understanding of wafer fabrication steps and…”
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Gridding techniques for the level set method in semiconductor process and device simulation by Kan, E.C., Ze-Kai Hsiau, Rao, V., Dutton, R.W.

“…Owing to the static and nonconformal mesh it employs, the level-set method for geometry representation offers several attractive alternatives for boundary…”
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