Search Results - "Zaal, Jeroen J M"

Mechanical Design and Characterization for MEMS Thin-Film Packaging by Santagata, F., Zaal, J. J. M., Huerta, V. G., Mele, L., Creemer, J. F., Sarro, P. M.

“…In this paper, a thin-film packaging approach is developed. It is meant to provide microelectromechanical systems (MEMS) devices with hermetic encapsulation…”
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Challenges in the assembly and handling of thin film capped MEMS devices by Zaal, Jeroen J M, van Driel, Willem D, Zhang, G Q

“…This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly…”
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Characterization of a Piezoresistive Sensor for In-Situ Health Monitoring of Solder Bumps by Inamdar, Adwait, Thukral, Varun, Zhang, Letian, Zaal, Jeroen J. M., Van Soestbergen, Michiel, Tuinhout, Hans, Van Driel, Willem D., Zhang, GuoQi

“…Solder joint failure is one of the most common board-level failure modes in electronic components. It is crucial for a next-generation reliability assessment…”
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