Search Results - "Yueh-Chin Lin"
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Gate Recessed Quasi-Normally OFF Al2O3/AlGaN/GaN MIS-HEMT With Low Threshold Voltage Hysteresis Using PEALD AlN Interfacial Passivation Layer
Published in IEEE electron device letters (01-07-2014)“…In this letter, a gate recessed normally OFF AlGaN/GaN MIS-HEMT with low threshold voltage hysteresis using Al 2 O 3 /AlN stack gate insulator is presented…”
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High-Performance Normally-OFF GaN MIS-HEMTs Using Hybrid Ferroelectric Charge Trap Gate Stack (FEG-HEMT) for Power Device Applications
Published in IEEE electron device letters (01-07-2018)“…A GaN metal-insulator-semiconductor-high electron mobility transistor (HEMT) using hybrid ferroelectric charge trap gate stack (FEG-HEMT) is demonstrated for…”
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RF loss mechanisms in GaN‐based high‐electron‐mobility‐transistor on silicon: Role of an inversion channel at the AlN/Si interface
Published in Physica status solidi. A, Applications and materials science (01-07-2017)“…One of the epitaxial issues pertaining to the growth of AlGaN/GaN HEMTs on Si is the decrease of parasitic losses that can adversely impact the RF device…”
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GaN MIS-HEMTs With Nitrogen Passivation for Power Device Applications
Published in IEEE electron device letters (01-10-2014)“…A GaN MIS-HEMT with nitrogen (N)-passivation for power device applications is demonstrated. In this letter, nitrogen radicals were adopted to recover…”
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Study of AlGaN/GaN High‐Electron‐Mobility Transistors on Si Substrate with Thick Copper‐Metallized Interconnects for Ka‐Band Applications
Published in Physica status solidi. A, Applications and materials science (01-04-2023)“…Herein, the AlGaN/GaN high‐electron‐mobility transistors (HEMTs) on silicon substrates using thick copper‐metallized interconnects with Pt diffusion barrier…”
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Improvement of AlGaN/GaN High-Electron-Mobility Transistor Radio Frequency Performance Using Ohmic Etching Patterns for Ka-Band Applications
Published in Micromachines (Basel) (01-01-2024)“…In this paper, AlGaN/GaN high-electron-mobility transistors (HEMTs) with ohmic etching patterns (OEPs) "fabricated to improve device radio frequency (RF)…”
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Adoption of the Wet Surface Treatment Technique for the Improvement of Device Performance of Enhancement-Mode AlGaN/GaN MOSHEMTs for Millimeter-Wave Applications
Published in Materials (01-11-2021)“…In this work, a low-power plasma oxidation surface treatment followed by Al2O3 gate dielectric deposition technique is adopted to improve device performance of…”
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A Tall Gate Stem GaN HEMT with Improved Power Density and Efficiency at Ka-Band
Published in IEEE journal of the Electron Devices Society (01-01-2023)“…In this letter, AlGaN/GaN HEMTs with tall-gate-stem structures were realized to improve the power performance of Ka-band devices, and a film thinning process…”
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Improvement of AlGaN/GaN HEMTs Linearity Using Etched-Fin Gate Structure for Ka Band Applications
Published in Micromachines (Basel) (25-04-2023)“…In this paper, AlGaN/GaN high electron mobility transistors (HEMTs) with etched-fin gate structures fabricated to improve device linearity for Ka-band…”
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A Novel GaN:C Millimeter-Wave HEMT with AlGaN Electron-Blocking Layer
Published in Materials (18-01-2022)“…An AlGaN/GaN/Si high electron mobility transistor (HEMT) using a GaN:C buffer with a 2 nm AlGaN electron-blocking layer (EBL) is investigated for the first…”
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Improvement of AlGaN/GaN HEMT Noise Figure Using Thick Cu Metallization for Satellite Communication Applications
Published in IEEE journal of the Electron Devices Society (2024)“…In this study, AlGaN/GaN high-electron-mobility-transistor (HEMT) with thick Cu metallization is investigated, and the Radio Frequency (RF) performance and the…”
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Noise Performance Investigation of AlGaN/GaN HEMT With Tall Gate Stem for Millimeter-Wave LNA Application
Published in IEEE journal of the Electron Devices Society (2023)“…In this research, <inline-formula> <tex-math notation="LaTeX">\Gamma </tex-math></inline-formula>-gated AlGaN/GaN HEMTs with different layout designs and…”
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Over 10W/mm High Power Density AlGaN/GaN HEMTs With Small Gate Length by the Stepper Lithography for Ka-Band Applications
Published in IEEE journal of the Electron Devices Society (01-01-2023)“…This study reports AlGaN/GaN high-electron-mobility transistors (HEMTs) fabricated by the Stepper Lithography on a 4-inch wafer for Ka-Band applications. Small…”
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Electrical Analysis and PBTI Reliability of In0.53Ga0.47As MOSFETs With AlN Passivation Layer and NH3 Postremote Plasma Treatment
Published in IEEE transactions on electron devices (01-09-2016)“…We report a notable improvement in performance, electron transport, and reliability of HfO 2 /In 0.53 Ga 0.47 As nMOSFETs using a plasma-enhanced atomic layer…”
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Normally-OFF GaN MIS-HEMT With F− Doped Gate Insulator Using Standard Ion Implantation
Published in IEEE journal of the Electron Devices Society (01-01-2018)“…A normally-OFF GaN metal-insulator-gate high electron mobility transistors with fluorine doped gate insulator has been fabricated using standard ion…”
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Study of E-Mode AlGaN/GaN MIS-HEMT with La-silicate Gate Insulator for Power Applications
Published in Journal of electronic materials (01-02-2020)“…An enhancement-mode (E-mode) AlGaN/GaN metal–insulator–semiconductor high-electron-mobility transistor (MIS-HEMT) with La 2 O 3 /SiO 2 gate insulator is…”
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AlGaN/GaN MIS-HEMTs With High Quality ALD-Al2O3 Gate Dielectric Using Water and Remote Oxygen Plasma As Oxidants
Published in IEEE journal of the Electron Devices Society (01-01-2018)“…We demonstrate the electrical performances of AlGaN/GaN metal-insulator-semiconductor-high electron mobility transistors (MIS-HEMTs) with high quality Al 2 O 3…”
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InGaAs QW-MOSFET Performance Improvement Using a PEALD-AlN Passivation Layer and an In-Situ NH3 Post Remote-Plasma Treatment
Published in IEEE electron device letters (01-03-2017)“…In this letter, we report on the impact of a PEALD-AlN interfacial passivation layer (IPL) and an in-situ NH 3 post remote-plasma (PRP) treatment onto InGaAs…”
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InGaAs Junctionless FinFETs With Self-Aligned Ni-InGaAs S/D
Published in IEEE journal of the Electron Devices Society (2018)“…In this paper, the InGaAs junctionless (JL) FinFET with notable electrical performance is demonstrated. The device with <inline-formula> <tex-math…”
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Evaluation of a 100-nm Gate Length E-Mode InAs High Electron Mobility Transistor With Ti/Pt/Au Ohmic Contacts and Mesa Sidewall Channel Etch for High-Speed and Low-Power Logic Applications
Published in IEEE journal of the Electron Devices Society (01-01-2018)“…In this paper, a 100-nm gate length InAs high electron mobility transistor (HEMT) with non-alloyed Ti/Pt/Au ohmic contacts and mesa sidewall channel etch was…”
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