Search Results - "Yue-Seon Shin"
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Joint properties of solder capped copper pillars for 3D packaging
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01-06-2010)“…Demand for high speed, high density, small size, and multifunctional electronic devices has driven the development of 3D integration. Cu pillar bumps have…”
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Conference Proceeding
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2
Effect of Dispersed SiC Nano-particles in Eutectic Sn58Bi Solder Micro-Bumps of Wafer Level Package by Electroplating
Published in 2008 10th Electronics Packaging Technology Conference (01-12-2008)“…In this paper, the effect of SiC nano-particles in micro-solder bump was investigated. SiC nano-particles were dispersed by using ultrasonic homogenizer in…”
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Conference Proceeding -
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Mechanical and microstructural properties of SiC-mixed Sn-Bi composite solder bumps by electroplating
Published in 2009 European Microelectronics and Packaging Conference (01-06-2009)“…SiC-nanoparticle-mixed Sn58Bi solders were successfully produced by electroplating and the mechanical and microstructural properties of Sn58Bi+SiC solders were…”
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Conference Proceeding