Search Results - "Younghee Song"
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1
Thermal Characteristics of Chip Stack and Package Stack Memory Devices in the Component and Module Level
Published in Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01-03-2007)“…The demand of the high storage memory is providing a momentum for stacking technology in DRAM industry. As the stack technology is developed, more heat sources…”
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2
Brand Trust and Affect in the Luxury Brand-Customer Relationship
Published in Social behavior and personality (01-03-2012)“…The influences of trust and affect on increasing likelihood to purchase luxury brands was examined. Because in most existing studies of luxury brand female…”
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3
Measuring Perceived Influences of Immigration Rules on Career Exploration among International Students
Published in Journal of college student development (01-09-2022)“…We developed a 6-item scale (PIIRCES) measuring the perceived influence of immigration rules on career explorations among international students. For…”
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4
Between global dreams and national duties: the dilemma of conscription duty in the transnational lives of young Korean males
Published in Global networks (Oxford) (01-01-2015)“…In this study, I examine the dilemmas arising from the tension between citizen duties and youthful aspirations in a globalizing world. The state's requirement…”
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5
Effect of surface conditions on interfacial adhesion between PCB and EMC
Published in 2007 International Conference on Electronic Materials and Packaging (01-11-2007)“…Adhesion strength of PCB and EMC interface was investigated. Surface conditions of PCB such as the number of plasma treatment, delay time before EMC molding,…”
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6
Emotion culture as a resource of sensemaking: Transforming an arson case of a Korean national heritage to citizens’ responsibility
Published in Poetics (Amsterdam) (01-04-2016)“…•The importance of culture in developing public understanding of social problems.•News content analysis of an arson case involving a Korean national heritage,…”
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7
High-performance Substrate Design for DRAM Flip-chip Interconnection using Etch-back Process
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01-05-2007)“…To apply an Au-stud bumping, which has the merit of being a supportable fine pad/bump pitch comparable to that of conventional wire-bonding, in the…”
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Development of Reliability Verification System for Robust Package Design
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01-04-2007)“…To achieve design for reliability (DFR), a reliability verification system (RVS) was developed. Package level and board level reliabilities were predicted by…”
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The influence of immigration regulations on career outcome expectations among international students
Published in International journal for educational and vocational guidance (26-06-2023)Get full text
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10
Evaluation of Platelet Indices for Differential Diagnosis of Thrombocytosis by ADVIA 120
Published in Blood (20-11-2009)“…Abstract 4472 Because there is no single clinical or laboratory finding for the diagnosis of essential thrombocythemia (ET), a differential diagnosis of other…”
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Transnational Masculinity in the Eyes of Local Beholders? Young Americans’ Perception of K-Pop Masculinities
Published in The Journal of men's studies (01-03-2020)“…The advancement in communication technology has created myriad online media sources through which people from different cultural backgrounds meet more…”
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12
The Generational Effects on Collective Memories in the Context of International Migration: The Collective Memories of Koreans in South Korea and the U.S
Published in Sociological spectrum (01-01-2013)“…This article examines generational effects on collective memories of Korean history, while taking into account international migration. We asked 216 subjects…”
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13
Opening the Contemplative Mind in the Sociology Classroom
Published in Humanity & society (01-08-2014)“…We examined the usefulness of mindfulness practices for developing understandings of the intersection between the individual and social milieu. After…”
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14
Characterization of Wire Bondability on Overhang Structured Chip in Multi Chip Package
Published in 2006 International Conference on Electronic Materials and Packaging (01-12-2006)“…Characteristics of wire bonding on the overhang structured chip were investigated in this study. During the wire bonding process, chip crack and bondability…”
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