Search Results - "Young Woo Lee"

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  1. 1

    Monolayer optical memory cells based on artificial trap-mediated charge storage and release by Lee, Juwon, Pak, Sangyeon, Lee, Young-Woo, Cho, Yuljae, Hong, John, Giraud, Paul, Shin, Hyeon Suk, Morris, Stephen M., Sohn, Jung Inn, Cha, SeungNam, Kim, Jong Min

    Published in Nature communications (24-03-2017)
    “…Monolayer transition metal dichalcogenides are considered to be promising candidates for flexible and transparent optoelectronics applications due to their…”
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  2. 2

    In situ observation of the formation of MoDTC-derived tribofilm on a ta-C coating using reflectance spectroscopy and its effects on friction by Hashizume, Naoya, Murashima, Motoyuki, Umehara, Noritsugu, Tokoroyama, Takayuki, Lee, Woo-Young

    Published in Tribology international (01-10-2021)
    “…We clarify the relationships between tribofilm thickness, chemical composition, and friction coefficient by combining in situ and ex situ analyses. An in situ…”
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  3. 3

    Reduced-Pin-Count BOST for Test-Cost Reduction by Lee, Youngkwang, Lee, Young-Woo, Seo, Sungyoul, Kang, Sungho

    “…Built-off self-test (BOST) is a widely used technique to reduce the test cost. It makes it possible to test high-speed dynamic random-access memory (DRAM)…”
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  4. 4

    Strain-Mediated Interlayer Coupling Effects on the Excitonic Behaviors in an Epitaxially Grown MoS2/WS2 van der Waals Heterobilayer by Pak, Sangyeon, Lee, Juwon, Lee, Young-Woo, Jang, A-Rang, Ahn, Seongjoon, Ma, Kyung Yeol, Cho, Yuljae, Hong, John, Lee, Sanghyo, Jeong, Hu Young, Im, Hyunsik, Shin, Hyeon Suk, Morris, Stephen M, Cha, SeungNam, Sohn, Jung Inn, Kim, Jong Min

    Published in Nano letters (13-09-2017)
    “…van der Waals heterostructures composed of two different monolayer crystals have recently attracted attention as a powerful and versatile platform for studying…”
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  5. 5

    Effect of fracture properties and surface morphology on wear of DLC coatings at severe contact condition by Yamada, Yusei, Murashima, Motoyuki, Umehara, Noritsugu, Tokoroyama, Takayuki, Lee, Woo-Young, Takamatsu, Hajime, Tanaka, Yoshikazu, Utsumi, Yoshiharu

    Published in Tribology international (01-05-2022)
    “…The present study shows how the fracture properties and surface morphology of diamond-like carbon (DLC) coatings affect their wear properties. Nine types of…”
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  7. 7

    Unusual Raman Enhancement Effect of Ultrathin Copper Sulfide by Kim, Gwangwoo, Jeong, Du Won, Lee, Geonhee, Lee, Suok, Ma, Kyung Yeol, Hwang, Hyuntae, Jang, Seunghun, Hong, John, Pak, Sangyeon, Cha, SeungNam, Cho, Donghwi, Kim, Sunkyu, Lim, Jongchul, Lee, YoungWoo, Shin, Hyeon Suk, Jang, A‐Rang, Lee, Jeong‐O

    “…In surface‐enhanced Raman spectroscopy (SERS), 2D materials are explored as substrates owing to their chemical stability and reproducibility. However, they…”
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  8. 8

    Robust Secure Shield Architecture for Detection and Protection Against Invasive Attacks by Lee, Young-woo, Lim, Hyeonchan, Lee, Youngkwang, Kang, Sungho

    “…Invasive attacks, such as microprobing or focused-ion-beam (FIB) circuit editing are serious threats to security-related semiconductors. To ensure that there…”
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  9. 9

    Timestamp-Based Secure Shield Architecture for Detecting Invasive Attacks by Bae, Junyeong, Oh, Junseok, Lee, Myoung Jin, Lee, Young-woo

    “…The design-for-security (DFS) methodology protects hardware and systems from physical attacks on chips while incorporating additional circuits to detect…”
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  10. 10

    Charge Transport Modulation of a Flexible Quantum Dot Solar Cell Using a Piezoelectric Effect by Cho, Yuljae, Giraud, Paul, Hou, Bo, Lee, YoungWoo, Hong, John, Lee, Sanghyo, Pak, Sangyeon, Lee, Juwon, Jang, Jae Eun, Morris, Stephen M., Sohn, Jung Inn, Cha, SeungNam, Kim, Jong Min

    Published in Advanced energy materials (25-01-2018)
    “…Colloidal quantum dots are promising materials for flexible solar cells, as they have a large absorption coefficient at visible and infrared wavelengths, a…”
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  11. 11

    Recent Progress in Electric‐field Enhanced 3D Graphene Electrodes using Laser Scribing for In‐plane Microsupercapacitors by Pak, Sangyeon, Jang, A‐Rang, Lee, YoungWoo

    Published in ChemElectroChem (15-03-2024)
    “…The increasing demand for miniature, flexible electronic devices have fueled the need for compact and high‐performing energy storage solutions…”
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  12. 12

    Clarification of the effects of adsorption films of ester-blended oil on friction by in situ reflectance spectroscopy by Hirata, Kodai, Murashima, Motoyuki, Umehara, Noritsugu, Tokoroyama, Takayuki, Hashizume, Naoya, Lee, Woo-Young, Takekawa, Daisuke, Narita, Keiichi

    Published in Tribology international (01-09-2023)
    “…In recent years, the demand for friction reduction in oil lubrication systems has become increasingly important due to the need to improve fuel economy and…”
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  13. 13

    Novel friction stabilization technology for surface damage conditions using machine learning by Murashima, Motoyuki, Yamada, Takazumi, Umehara, Noritsugu, Tokoroyama, Takayuki, Lee, Woo-Young

    Published in Tribology international (01-02-2023)
    “…The surface damage is a serious cause of failure in tribosystems. In the present paper, we propose a new damage avoidance method that combines a contact…”
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  14. 14

    A low-cost concurrent TSV test architecture with lossless test output compression scheme by Lee, Young-Woo, Lim, Hyunchan, Seo, Sungyoul, Cho, Keewon, Kang, Sungho

    Published in PloS one (23-08-2019)
    “…As the traditional IC design migrates to three-dimensional integrated circuits (3D-ICs) design, new challenges need to be considered carefully to solve its…”
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  15. 15

    New in situ low-friction technology for diamond-like carbon coatings using surface discharge treatment in ambient air by Murashima, Motoyuki, Oyama, Shintaro, Kousaka, Hiroyuki, Tokoroyama, Takayuki, Lee, Woo-Young, Umehara, Noritsugu

    Published in Tribology international (01-01-2022)
    “…In the present paper, we develop a new in situ low-friction technology for diamond-like carbon coatings using surface discharge in ambient air. As a result,…”
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  16. 16

    Effect of defects on wear behavior in ta-C coating prepared by filtered cathodic vacuum arc deposition by Lee, Woo-Young, Jang, Young-Jun, Tokoroyama, Takayuki, Murashima, Motoyuki, Umehara, Noritsugu

    Published in Diamond and related materials (01-05-2020)
    “…This study examined the tribological behavior of a ta-C coating fabricated at a substrate bias of −100 V via filtered cathodic vacuum arc (FCVA) deposition…”
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  17. 17

    Direct Epitaxial Synthesis of Selective Two-Dimensional Lateral Heterostructures by Lee, Juwon, Pak, Sangyeon, Lee, Young-Woo, Park, Youngsin, Jang, A-Rang, Hong, John, Cho, Yuljae, Hou, Bo, Lee, Sanghyo, Jeong, Hu Young, Shin, Hyeon Suk, Morris, Stephen M, Cha, SeungNam, Sohn, Jung Inn, Kim, Jong Min

    Published in ACS nano (26-11-2019)
    “…Two-dimensional (2D) heterostructured or alloyed monolayers composed of transition metal dichalcogenides (TMDCs) have recently emerged as promising materials…”
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  18. 18

    Row Hammer Reduction Using a Buried Insulator in a Buried Channel Array Transistor by Park, Jin Hyo, Kim, Su Yeon, Kim, Dong Young, Kim, Geon, Park, Je Won, Yoo, Sunyong, Lee, Young-Woo, Lee, Myoung Jin

    Published in IEEE transactions on electron devices (01-12-2022)
    “…In this article, we propose an analysis of the usage of a partial isolation type buried channel array transistor (Pi-BCAT). Compared with other structures, the…”
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  19. 19

    Enhancing the Electrochemical Energy Storage Performance of Bismuth Ferrite Supercapacitor Electrodes via Simply Induced Anion Vacancies by Jo, Seunghwan, Pak, Sangyeon, Lee, Young-Woo, Cha, SeungNam, Hong, John, Sohn, Jung Inn

    Published in International journal of energy research (06-02-2023)
    “…Increasing the content of anion vacancies may yield significant improvement in the overall electrochemical energy-storing performance of perovskite materials,…”
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  20. 20

    Grouping-Based TSV Test Architecture for Resistive Open and Bridge Defects in 3-D-ICs by Lee, Young-woo, Lim, Hyeonchan, Kang, Sungho

    “…After the 3-D stacking, 3-D-ICs based on through-silicon-vias (TSVs) must be inspected for any TSV defects such as resistive open or bridge defects. In some…”
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