Search Results - "Young Woo Lee"
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1
Monolayer optical memory cells based on artificial trap-mediated charge storage and release
Published in Nature communications (24-03-2017)“…Monolayer transition metal dichalcogenides are considered to be promising candidates for flexible and transparent optoelectronics applications due to their…”
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2
In situ observation of the formation of MoDTC-derived tribofilm on a ta-C coating using reflectance spectroscopy and its effects on friction
Published in Tribology international (01-10-2021)“…We clarify the relationships between tribofilm thickness, chemical composition, and friction coefficient by combining in situ and ex situ analyses. An in situ…”
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3
Reduced-Pin-Count BOST for Test-Cost Reduction
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01-03-2022)“…Built-off self-test (BOST) is a widely used technique to reduce the test cost. It makes it possible to test high-speed dynamic random-access memory (DRAM)…”
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4
Strain-Mediated Interlayer Coupling Effects on the Excitonic Behaviors in an Epitaxially Grown MoS2/WS2 van der Waals Heterobilayer
Published in Nano letters (13-09-2017)“…van der Waals heterostructures composed of two different monolayer crystals have recently attracted attention as a powerful and versatile platform for studying…”
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5
Effect of fracture properties and surface morphology on wear of DLC coatings at severe contact condition
Published in Tribology international (01-05-2022)“…The present study shows how the fracture properties and surface morphology of diamond-like carbon (DLC) coatings affect their wear properties. Nine types of…”
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6
Thermodynamically Stable Synthesis of Large‐Scale and Highly Crystalline Transition Metal Dichalcogenide Monolayers and their Unipolar n–n Heterojunction Devices
Published in Advanced materials (Weinheim) (01-09-2017)“…Transition metal dichalcogenide (TMDC) monolayers are considered to be potential materials for atomically thin electronics due to their unique electronic and…”
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7
Unusual Raman Enhancement Effect of Ultrathin Copper Sulfide
Published in Small (Weinheim an der Bergstrasse, Germany) (01-03-2024)“…In surface‐enhanced Raman spectroscopy (SERS), 2D materials are explored as substrates owing to their chemical stability and reproducibility. However, they…”
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8
Robust Secure Shield Architecture for Detection and Protection Against Invasive Attacks
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01-10-2020)“…Invasive attacks, such as microprobing or focused-ion-beam (FIB) circuit editing are serious threats to security-related semiconductors. To ensure that there…”
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9
Timestamp-Based Secure Shield Architecture for Detecting Invasive Attacks
Published in IEEE transactions on very large scale integration (VLSI) systems (01-09-2023)“…The design-for-security (DFS) methodology protects hardware and systems from physical attacks on chips while incorporating additional circuits to detect…”
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10
Charge Transport Modulation of a Flexible Quantum Dot Solar Cell Using a Piezoelectric Effect
Published in Advanced energy materials (25-01-2018)“…Colloidal quantum dots are promising materials for flexible solar cells, as they have a large absorption coefficient at visible and infrared wavelengths, a…”
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11
Recent Progress in Electric‐field Enhanced 3D Graphene Electrodes using Laser Scribing for In‐plane Microsupercapacitors
Published in ChemElectroChem (15-03-2024)“…The increasing demand for miniature, flexible electronic devices have fueled the need for compact and high‐performing energy storage solutions…”
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12
Clarification of the effects of adsorption films of ester-blended oil on friction by in situ reflectance spectroscopy
Published in Tribology international (01-09-2023)“…In recent years, the demand for friction reduction in oil lubrication systems has become increasingly important due to the need to improve fuel economy and…”
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13
Novel friction stabilization technology for surface damage conditions using machine learning
Published in Tribology international (01-02-2023)“…The surface damage is a serious cause of failure in tribosystems. In the present paper, we propose a new damage avoidance method that combines a contact…”
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14
A low-cost concurrent TSV test architecture with lossless test output compression scheme
Published in PloS one (23-08-2019)“…As the traditional IC design migrates to three-dimensional integrated circuits (3D-ICs) design, new challenges need to be considered carefully to solve its…”
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15
New in situ low-friction technology for diamond-like carbon coatings using surface discharge treatment in ambient air
Published in Tribology international (01-01-2022)“…In the present paper, we develop a new in situ low-friction technology for diamond-like carbon coatings using surface discharge in ambient air. As a result,…”
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16
Effect of defects on wear behavior in ta-C coating prepared by filtered cathodic vacuum arc deposition
Published in Diamond and related materials (01-05-2020)“…This study examined the tribological behavior of a ta-C coating fabricated at a substrate bias of −100 V via filtered cathodic vacuum arc (FCVA) deposition…”
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17
Direct Epitaxial Synthesis of Selective Two-Dimensional Lateral Heterostructures
Published in ACS nano (26-11-2019)“…Two-dimensional (2D) heterostructured or alloyed monolayers composed of transition metal dichalcogenides (TMDCs) have recently emerged as promising materials…”
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18
Row Hammer Reduction Using a Buried Insulator in a Buried Channel Array Transistor
Published in IEEE transactions on electron devices (01-12-2022)“…In this article, we propose an analysis of the usage of a partial isolation type buried channel array transistor (Pi-BCAT). Compared with other structures, the…”
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19
Enhancing the Electrochemical Energy Storage Performance of Bismuth Ferrite Supercapacitor Electrodes via Simply Induced Anion Vacancies
Published in International journal of energy research (06-02-2023)“…Increasing the content of anion vacancies may yield significant improvement in the overall electrochemical energy-storing performance of perovskite materials,…”
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20
Grouping-Based TSV Test Architecture for Resistive Open and Bridge Defects in 3-D-ICs
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01-10-2017)“…After the 3-D stacking, 3-D-ICs based on through-silicon-vias (TSVs) must be inspected for any TSV defects such as resistive open or bridge defects. In some…”
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