Search Results - "Yoo, HoDol"

Enhanced light extraction efficiency of GaN-based LED fabricated by multi-chip array by Yoo, Hodol, Ha, Kab, Baek, Ji-Young, Jung, Mee-Suk, Su, Pei-Chen, Kim, Yoonsu, Cheon, Suyoung, Cho, Soohaeng, Kim, Kyoung-Kook

“…In this study, we report the enhanced light extraction efficiency of light emitting diode (LED) devices by employing multi-chip arrayed LED structures. We…”
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Wafer Level Void-Free Molded Underfill for High-Density Fan-out Packages by Mok, InSu, Bae, JaeHun, Ki, WonMyoung, Yoo, HoDol, Ryu, SeungMan, Kim, SooHyun, Jung, GyuIck, Hwang, TaeKyeong, Do, WonChul

“…In this study, experiments and mold flow simulation results are presented for a void-free wafer level molded underfill (WLMUF) process with High-Density…”
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A Novel System-in-Package using High-Density Fan-out Technology for Heterogeneous Integration by Son, SeungNam, Yoo, HoDol, Kim, Ji Hyun, Kim, JooHyun, Lee, DooWon, Do, WonChul, Ra, Yun, So, KwangSup, Paik, WooHyun, Lee, KangWook

“…A new Wafer Level System-in-Package (WLSiP) has been designed and developed where Application Processor (AP), Low Power Double Data Rate 4 (LPDDR4) memory, and…”
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