Search Results - "Yess, Kim"

Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material by Phommahaxay, Alain, Potoms, Goedele, Verbinnen, Greet, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Dongshun Bai, Xiao Liu, Yess, Kim, Arnold, Kim, Spiess, Walter, Griesbach, Tim, Rapps, Thomas, Lutter, Stefan

“…Over the past few years, temporary bonding has spread together with the development of 3D stacked IC (SIC) technology. Maturity of the various processes has…”
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Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up by Podpod, Arnita, Phommahaxay, Alain, Bex, Pieter, Slabbekoorn, John, Bertheau, Julien, Salahoueldhadj, Abdellah, Sleeckx, Erik, Miller, Andy, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Yess, Kim, Arnold, Kim

“…As the need for higher degrees of function integration on chips continues to rise, chip-to-chip connection density exponentially increases. The continuous push…”
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The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics by Phommahaxay, Alain, Beyer, Gerald, Radu, Iuliana, Beyne, Eric, Guerrero, Alice, Prenger, Luke, Yess, Kim, Arnold, Kim, Tussing, Sebastian, Spiess, Walter, Rapps, Thomas, Kennes, Koen, Lutter, Stefan, Podpod, Arnita, Brems, Steven, Slabbekoorn, John, Sleeckx, Erik, Huyghebaert, Cedric, Asselberghs, Inge, Miller, Andy

“…Thin substrate handling has become one of the cornerstone technologies that enabled the development of 3D stacked ICs over the past years. Temporary wafer…”
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Novel Temporary Bonding and Debonding Solutions Enabling an Ultrahigh Interonnect Density Fo-Wlp Structure Assembly with Quasi-Zero Die Shift by Podpod, Arnita, Miller, Andy, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Liu, Xiao, Wu, Qi, Yess, Kim, Arnold, Kim, Phommahaxay, Alain, Bex, Pieter, Kennes, Koen, Bertheau, Julien, Arumugam, Hariharan, Cochet, Tom, Rebibis, Kenneth, Sleeckx, Erick

“…Next-generation temporary bonding adhesive material is introduced into imec's high interconnect density flip chip on fan-out wafer-level package (FC FOWLP)…”
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Advances in Thin Wafer Debonding and Ultrathin 28-nm FinFET Substrate Transfer by Phommahaxay, Alain, Jourdain, Anne, Potoms, Goedele, Verbinnen, Greet, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Dongshun Bai, Yess, Kim, Arnold, Kim

“…Over the past few years, temporary bonding has expanded together with the development of 3D stacked IC (SIC) technology. As maturity of the various processes…”
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Single-release-layer process for temporary bonding applications in the 3D integration area by Jourdain, Anne, Phommahaxay, Alain, Velenis, Dimitrios, Guerrero, Alice, Dongshun Bai, Yess, Kim, Arnold, Kim, Miller, Andy, Rebibis, Kenneth, Beyer, Gerald, Beyne, Eric

“…One of the key aspects in 3D technology today is the bonding/debonding of a device wafer to a carrier wafer to enable wafer thinning and subsequent backside…”
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