Search Results - "Yeap, K.B."

Nanosecond Laser Anneal for BEOL Performance Boost in Advanced FinFETs by Lee, Rinus T.P., Petrov, N., Kassim, J., Gribelyuk, M., Yang, J., Cao, L., Yeap, K.B., Shen, T., Zainuddin, A. N., Chandrashekar, A., Ray, S., Ramanathan, E., Mahalingam, A. S., Chaudhuri, R., Mody, J., Damjanovic, D., Sun, Z., Sporer, R., Tang, T. J., Liu, H., Liu, J., Krishnan, B.

“…Nanosecond laser-induced grain growth in Cu interconnects is demonstrated for the first time using 14nm FinFET technology. We achieved a 35% reduction in Cu…”
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The effect of oxidation on the corrosion resistance and mechanical properties of a Zr-based metallic glass by Nie, X.P., Yang, X.H., Chen, L.Y., Yeap, K.B., Zeng, K.Y., Li, D., Pan, J.S., Wang, X.D., Cao, Q.P., Ding, S.Q., Jiang, J.Z.

“…After oxidation at 593 K for 5 h, the Zr-based metallic glass exhibits superior passivation behavior in 0.5 M NaCl solutions. The corrosion behavior of BMG in…”
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Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects by Hauschildt, M., Hennesthal, C., Talut, G., Aubel, O., Gall, M., Yeap, K. B., Zschech, E.

“…Electromigration early failure void nucleation and growth phenomena were studied using large-scale, statistical analysis methods. A total of about 496,000…”
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Thermal oxidation effect on corrosion behavior of Zr 46Cu 37.6Ag 8.4Al 8 bulk metallic glass by Nie, X.P., Yang, X.H., Ma, Y., Chen, L.Y., Yeap, K.B., Zeng, K.Y., Li, D., Pan, J.S., Wang, X.D., Cao, Q.P., Ding, S.Q., Jiang, J.Z.

“…Oxide films of 0.72 μm and 1.80 μm were prepared by thermal oxidation treatments at 441 K and 609 K respectively. The oxidation kinetics of the Zr 46Cu 37.6Ag…”
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A computational and experimental investigation of three-dimensional micro-wedge indentation-induced interfacial delamination in a soft-film-on-hard-substrate system by Chen, L., Yeap, K.B., She, C.M., Liu, G.R.

“…A three-dimensional finite element (FEM) simulation was performed to study the mechanics of micro-wedge indentation-induced interfacial delamination of a soft…”
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Thermal oxidation effect on corrosion behavior of Zr46Cu37.6Ag8.4Al8 bulk metallic glass by Nie, X.P., Yang, X.H., Ma, Y., Chen, L.Y., Yeap, K.B., Zeng, K.Y., Li, D., Pan, J.S., Wang, X.D., Cao, Q.P., Ding, S.Q., Jiang, J.Z.

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Finite element simulation and experimental determination of interfacial adhesion properties by wedge indentation by Chen, L., Yeap, K.B., Zeng, K.Y., Liu, G.R.

“…This paper presents our recent study on determination of interfacial adhesion properties of soft-film-on-hard-substrate (SFHS) systems using finite element…”
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Testing The Limits of TaN Barrier Scaling by Witt, C., Yeap, K.B., Lesniewska, A., Wan, D., Jordan, N., Ciofi, I., Wu, C., Tokei, Z.

“…Continued scaling dimensions of interconnects used for Si chip integration reduces the available cross sectional area for conduction. As Cu requires a…”
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