Search Results - "Ye, Ang"
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Electrochemical Active Micro‐Protein Coating by Self‐Assembling 2D‐Microfluidics for Stabilizing Lithium Metal Anode
Published in Advanced functional materials (01-02-2024)“…Microfluidics is of great interest for nano‐/micro‐fabrication but is conventionally limited inside microchannels. Breaking this restriction and developing…”
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Architecting the Microenvironment Skeleton of Active Materials in High‐Capacity Electrodes by Self‐Assembled Nano‐Building Blocks
Published in Small (Weinheim an der Bergstrasse, Germany) (01-06-2024)“…In analogy to the cell microenvironment in biology, understanding and controlling the active‐material microenvironment (ME@AM) microstructures in battery…”
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LncRNA CRNDE facilitates epigenetic suppression of CELF2 and LATS2 to promote proliferation, migration and chemoresistance in hepatocellular carcinoma
Published in Cell death & disease (11-08-2020)“…Our study aimed to investigate the expression, functional significance, and related mechanism of long noncoding RNA CRNDE (colorectal neoplasia differentially…”
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Mechanically enhanced battery separator prepared by hot‐pressing electrospun polyvinylidene fluoride@polymethyl methacrylate membranes with different fiber orientations in adjacent layers
Published in Polymer engineering and science (01-04-2024)“…Compared with commercial polyolefin membranes, electrospun polymeric membranes have the advantages of higher porosity and better electrolyte wettability, but…”
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A pre-burning treatment facilitating formation of pores in biochars and reinforcing their electrochemical performance in supercapacitor
Published in Ionics (01-03-2024)“…Continuous efforts are always being made to reinforce biochars’ properties for large-scale utilization in new energy devices. Here, a pre-burning treatment is…”
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Magnetic anisotropy of epitaxial La2/3Sr1/3MnO3 thin films on SrTiO3 with different orientations
Published in AIP advances (01-12-2016)“…Epitaxial La2/3Sr1/3MnO3 thin films with different crystallographic orientations were fabricated on (001)-, (110)-, and (111)-oriented SrTiO3 substrates by…”
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Achieving Low-Energy-Barrier Ion Hopping in Adhesive Composite Polymer Electrolytes by Nanoabsorption
Published in Macromolecules (23-08-2022)“…Adhesive polymer electrolytes are of great interest for next-generation high-energy-density solid-state batteries but their practical applications have been…”
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Derivative carbon particles with different sizes from ZIF-8 and their adsorption capacity for MB
Published in Journal of materials science (01-02-2023)“…Metal–organic framework materials (MOFs), as adsorbents, have been widely used in the adsorptive removal of dyes from water due to their adjustable…”
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An approach on underfill material selection for the low-k Flip Chip Plastic Ball Grid Array (FCPBGA)
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01-11-2008)“…The role of underfill is expanding from preserving solder joint reliability to also protecting fragile low-k chip dielectric layers in flip chip packaging. The…”
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Conference Proceeding -
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Implementation of novel reflow profile of no-clean fluxes to enhance flux stability and oxide layer removal of the high lead solder bump
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01-11-2008)“…Various reflow profiles have been applied on different no-clean fluxes amount in removing the oxide layer of high lead solder bump. The wafers exposed to open…”
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Conference Proceeding -
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The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA
Published in 2008 IEEE International Conference on Semiconductor Electronics (01-11-2008)“…Five different types of clean flux and no-clean flux, which are mainly used in flip chip die attach, have been analyzed in respect to the wettability of…”
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Conference Proceeding -
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Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)
Published in 2008 IEEE International Conference on Semiconductor Electronics (01-11-2008)“…Electrically conductive adhesive (ECA) is a popular alternative to replace lead solder interconnect material in most areas of electronic packaging. ECA mainly…”
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Conference Proceeding -
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Effects of carbon source types on denitrification performance at low temperature
Published in Huanjing kexue (01-01-2009)“…To investigate the responding behavior of denitrifying bacteria to different carbon source (i.e., methanol, ethanol, sodium acetate, sodiumpropionate, glucose,…”
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Remaking Chinese urban form - modernity, scarcity and space 1945-2005
Published in Planning Perspectives (01-04-2012)Get full text
Book Review Journal Article -
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Prognostic factor analysis of vitrectomy for myopic foveoschisis
Published in British journal of ophthalmology (01-12-2015)“…To describe the anatomical and functional outcomes in a cohort of subjects undergoing vitrectomy for myopic foveoschisis, and to analyse the factors predicting…”
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Dectin -1 expression at early period of Aspergillus fumigatus infection in rat’s corneal epithelium
Published in International journal of ophthalmology (2013)“…AIM:To investigate the expression of dendritic cell-associated C-type lectin-1 (dectin-1) at the early period of Aspergillus fumigatus infection in rat’s…”
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