Electrically conductive carbon fiber reinforced plastics induced by uneven distribution of polyaniline composite micron-sized particles in thermosetting matrix

We developed electrically conductive carbon fiber reinforced plastic (CFRP) for lightning strike protection by infusing carbon fiber (CF) woven fabric with a low viscosity liquid conductive thermosetting resin, providing a conductivity in the thickness direction of the CFRP of above 0.1 S/cm. The no...

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Bibliographic Details
Published in:Composites science and technology Vol. 228; p. 109642
Main Authors: Takahashi, Kohei, Yaginuma, Katsuya, Goto, Teruya, Yokozeki, Tomohiro, Okada, Takao, Takahashi, Tatsuhiro
Format: Journal Article
Language:English
Published: Elsevier Ltd 29-09-2022
Online Access:Get full text
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Summary:We developed electrically conductive carbon fiber reinforced plastic (CFRP) for lightning strike protection by infusing carbon fiber (CF) woven fabric with a low viscosity liquid conductive thermosetting resin, providing a conductivity in the thickness direction of the CFRP of above 0.1 S/cm. The novel CFRP fabrication method uses a styrene derivative based thermosetting resin liquid dispersion including newly designed micron-size polyaniline (PANI)/dodecyl benzene sulfonic acid (DBSA) based composite particles. The dispersion liquid showed low viscosity and no viscosity increase at room temperature, and could penetrate into CF woven fabric and undergo a cross-linking reaction after heating to around 120 °C. Nine-layered stacked sheets were hot-pressed to make solid laminated composites with 50 vol% CF. The cross-section in the thickness direction was analyzed by optical microscopy, scanning electron microscopy, and electron probe microanalysis to determine the distribution of PANI/DBSA particles and CF per unit area. It was found that PANI/DBSA particles were located between the binding of the plain-woven CF, and showed a conductivity of 0.5 S/cm in the thickness direction, even when the PANI amount was as small as 4 wt%. [Display omitted]
ISSN:0266-3538
1879-1050
DOI:10.1016/j.compscitech.2022.109642