Search Results - "Yaddanapudi, Vamsi Krishna"

Thermal Model Simplification of Mobile Device with Adaptive Metamodel of Optimal Prognosis (AMOP) by Im, Yunhyeok, Jo, Hyungyung, Oh, Chigwan, Cho, Young-Sang, Yoo, Jongkyu, Lee, Heeseok, Lee, Myunghoon, Yaddanapudi, Vamsi Krishna

“…The effective performance of system on chip (SOC) is tightly coupled with transient thermal behavior. To consider multiple design parameters in the limited…”
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Thermal Sensor Placement based on Meta-Model Enhancing Observability and Controllability by Im, Yunhyeok, Kim, Wook, An, Taekeun, Lee, Heeseok, Cho, Young-Sang, Yoo, Jongkyu, Lee, Hoi-Jin, Shin, Youngmin, Lee, Myunghoon, Yaddanapudi, Vamsi Krishna

“…On-chip thermal sensor (TS) is essential to prevent a chip from burn out and to increase its reliability. In addition, accuracy of temperature reading can…”
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Validation of new approach of modelling traces by mapping mechanical properties for a printed circuit board mechanical analysis by Yaddanapudi, Vamsi Krishna, Krishnaswamy, Sivasubramani, Rath, Rajiv, Gandhi, Rohith

“…Printed circuit boards (PCB) are found in almost all electronic devices. During manufacturing and field operation, these PCBs are subjected to different loads,…”
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DELPHI style extraction and validation of compact model for a multichip module package by Yaddanapudi, Vamsi Krishna, Kulkarni, Aniket Abhay, Adhiya, Ankit, Nagulapally, Manoj, Tan, Desmond

“…DELPHI style compact model generation for single chip packages is an electronics industry standard proposed by the JEDEC council. Such compact network models…”
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