Search Results - "YONG MENG LEE"
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Multi-axial Elastic Averaging for Sub-Micron Passive Alignment of Photonic Components
Published in Journal of lightwave technology (15-06-2023)“…In recent years, heterogeneous integration (HI) has become a game-changing technology for the construction of complex photonic integrated circuits. Comparing…”
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Journal Article -
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Blanket SMT With In Situ N2 Plasma Treatment on the (100) Wafer for the Low-Cost Low-Power Technology Application
Published in IEEE electron device letters (01-09-2009)Get full text
Journal Article -
3
An Improved Shift-and-Ratio Effective Channel Length Extraction Method for Metal Oxide Silicon Transistors with Halo/Pocket Implants
Published in Japanese Journal of Applied Physics (2003)“…The original shift-and-ratio method tends to over-estimate the effective channel length (Leff) of metal-oxide-Si (MOS) transistors with halo/pocket implants…”
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Journal Article -
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Blanket SMT With In Situ N2 Plasma Treatment on the \langle \hbox \rangle Wafer for the Low-Cost Low-Power Technology Application
Published in IEEE electron device letters (01-09-2009)“…PMOS degradation with the blanket-stress-memory-technique (SMT) nitride layer on the (100) wafer with ?100? orientation has been observed, and the degradation…”
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Journal Article -
5
Blanket SMT With In Situ N2 Plasma Treatment on the langle hbox 100 rangle Wafer for the Low-Cost Low-Power Technology Application
Published in IEEE electron device letters (01-01-2009)“…PMOS degradation with the blanket-stress-memory-technique (SMT) nitride layer on the (100) wafer with ?100? orientation has been observed, and the degradation…”
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Journal Article -
6
Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer
Published in 2022 European Conference on Optical Communication (ECOC) (18-09-2022)“…The incorporation of rectangular slide-stop structures improve post-bond accuracy by 1.6X achieving a best-in-class relative axial offset of 0.13μm…”
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Conference Proceeding -
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Comparison of latchup immunity for silicided source/drain at different n super(+) implant energy
Published in Microelectronics and reliability (01-09-1998)“…The effect of titanium silicided (TiSi sub(2)) on latchup immunity for different n super(+) source/drain (s/d) junction depth is investigated. Highly latchup…”
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Journal Article -
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Comparison of latchup immunity for silicided source/drain at different n + implant energy
Published in Microelectronics and reliability (01-09-1998)“…The effect of titanium disilicide (TiSi 2) on latchup immunity for different n + source/drain (s/d) junction depth is investigated. Highly latchup immune 0.25…”
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Journal Article -
9
Comparison of latchup immunity for silicided source/drain at different n+ implant energy
Published in 1997 IEEE Hong Kong Proceedings Electron Devices Meeting (1997)“…N-channel MOSFET devices with excellent latchup immunity for 0.25 /spl mu/m technology are fabricated with 50 /spl Aring/ gate oxide, retrograde N-Well,…”
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Conference Proceeding