Search Results - "YONG MENG LEE"

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  1. 1

    Multi-axial Elastic Averaging for Sub-Micron Passive Alignment of Photonic Components by Goh, Simon Chun Kiat, Siah, Chun Fei, Xu, Baochang, Zhang, Yu, Pam, Mei Er, Guevarra, Enrico, Goh, Edwin Sze Ping, Wang, Lin, Pile, Brian, Carlan, Arbiz, Lee, James Yong Meng, Venkatesan, Suresh, Lim, Yeow Kheng, Thean, Aaron Voon-Yew

    Published in Journal of lightwave technology (15-06-2023)
    “…In recent years, heterogeneous integration (HI) has become a game-changing technology for the construction of complex photonic integrated circuits. Comparing…”
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    Journal Article
  2. 2
  3. 3

    An Improved Shift-and-Ratio Effective Channel Length Extraction Method for Metal Oxide Silicon Transistors with Halo/Pocket Implants by Eng, Chee-Wee, Lau, Wai-Shing, Vigar, David, Lee, James Yong-Meng

    “…The original shift-and-ratio method tends to over-estimate the effective channel length (Leff) of metal-oxide-Si (MOS) transistors with halo/pocket implants…”
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    Journal Article
  4. 4

    Blanket SMT With In Situ N2 Plasma Treatment on the \langle \hbox \rangle Wafer for the Low-Cost Low-Power Technology Application by Jun Yuan, Chan, V., Rovedo, N., Sardesai, V., Kanike, N., Varadarajan, V., Yu, M., Jong Ho Yang, Jeong, Y.K., Kwon, O.S., Belyansky, M.P., Eller, M., Yong Meng Lee, Cave, N., Huiling Shang, Ying Li, Divakaruni, R.

    Published in IEEE electron device letters (01-09-2009)
    “…PMOS degradation with the blanket-stress-memory-technique (SMT) nitride layer on the (100) wafer with ?100? orientation has been observed, and the degradation…”
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    Journal Article
  5. 5

    Blanket SMT With In Situ N2 Plasma Treatment on the langle hbox 100 rangle Wafer for the Low-Cost Low-Power Technology Application by Yuan, Jun, Chan, V, Rovedo, N, Sardesai, V, Kanike, N, Varadarajan, V, Yu, M, Ho Yang, Jong, Jeong, Y K, Kwon, O S, Belyansky, M P, Eller, M, Meng Lee, Yong, Cave, N, Shang, Huiling, Li, Ying, Divakaruni, R

    Published in IEEE electron device letters (01-01-2009)
    “…PMOS degradation with the blanket-stress-memory-technique (SMT) nitride layer on the (100) wafer with ?100? orientation has been observed, and the degradation…”
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    Journal Article
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    Comparison of latchup immunity for silicided source/drain at different n super(+) implant energy by Leong, Kam-Chew, Liu, Po-Ching, Yeo, Kiat Seng, Gan, Chock-Hing, Qian, Gang, Lee, Yong-Meng, Chan, Lap

    Published in Microelectronics and reliability (01-09-1998)
    “…The effect of titanium silicided (TiSi sub(2)) on latchup immunity for different n super(+) source/drain (s/d) junction depth is investigated. Highly latchup…”
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    Journal Article
  8. 8

    Comparison of latchup immunity for silicided source/drain at different n + implant energy by Leong, Kam-Chew, Liu, Po-Ching, Yeo, Kiat Seng, Gan, Chock-Hing, Qian, Gang, Lee, Yong-Meng, Chan, Lap

    Published in Microelectronics and reliability (01-09-1998)
    “…The effect of titanium disilicide (TiSi 2) on latchup immunity for different n + source/drain (s/d) junction depth is investigated. Highly latchup immune 0.25…”
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    Journal Article
  9. 9

    Comparison of latchup immunity for silicided source/drain at different n+ implant energy by Leong Kam Chew, Liu Po Chen, Gan Chock Hing, Qian Gang, Lee Yong Meng, Lap Chan

    “…N-channel MOSFET devices with excellent latchup immunity for 0.25 /spl mu/m technology are fabricated with 50 /spl Aring/ gate oxide, retrograde N-Well,…”
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    Conference Proceeding