Search Results - "Xu, Guangchen"

Circular RNAs: Promising Treatment Targets and Biomarkers of Ischemic Stroke by Xu, Guangchen, Liu, Ge, Wang, Ziyu, Li, Yunman, Fang, Weirong

“…Ischemic stroke is one of the most significant causes of morbidity and mortality worldwide. However, there is a dearth of effective drugs and treatment methods…”
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Tripartite Motif Protein Family in Central Nervous System Diseases by Pan, Mengtian, Li, Xiang, Xu, Guangchen, Tian, Xinjuan, Li, Yunman, Fang, Weirong

“…Tripartite motif (TRIM) protein superfamily is a group of E3 ubiquitin ligases characterized by the conserved RING domain, the B-box domain, and the…”
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Research on tool remaining life prediction method based on CNN-LSTM-PSO by Wang, Shuo, Yu, Zhenliang, Xu, Guangchen, Zhao, Fengqin

“…Efficient and accurate prediction of tool Remaining Useful Life (RUL) is the key to improve product accuracy, improve work efficiency and reduce machining…”
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Thermal and insulating properties of epoxy/aluminum nitride composites used for thermal interface material by Yu, Hui, Li, Liangliang, Kido, Teruo, Xi, Guannan, Xu, Guangchen, Guo, Fu

“…We synthesized an epoxy matrix composite adhesive containing aluminum nitride (AlN) powder, which was used for thermal interface materials (TIM) in high power…”
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Interfacial phenomena in magnesium/aluminum bi-metallic castings by Xu, Guangchen, Luo, Alan A., Chen, Yiqing, Sachdev, Anil K.

“…This paper summarizes the bi-metallic experiments using a high-vacuum test apparatus to understand the interfacial phenomena between Mg (AM60) and Al (A390)…”
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Research of the single‐rotor UAV gimbal vibration test by Xu, Guangchen, Yu, Zhenliang, Liu, Guangming

“…Abstract An experimental study was conducted to investigate the phenomenon of UAV attitude instability caused by large vibrations affecting single‐rotor UAV…”
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Trifarotene alleviates skin photoaging injury by inhibition of JNK/c-Jun/MMPs by Fei, Xuan, Yang, Lele Zixin, Zhang, Jingjing, Li, Xiang, Pan, Mengtian, Xu, Guangchen, Zhang, Cuixia, Liu, Fei, Fang, Weirong

“…Long-term exposure to ultraviolet (UV) radiation induces skin photoaging, which manifests as oxidative stress, inflammation, and collagen degradation. Multiple…”
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Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple by He, Hongwen, Xu, Guangchen, Guo, Fu

“…Effect of small amount of rare earth (RE) addition on electromigration behavior of Cu/SnBi/Cu solder reaction couple (SRC) was investigated with current…”
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3D-Basin Modelling of the Lishui Sag: Research of Hydrocarbon Potential, Petroleum Generation and Migration by Zhang, Jinliang, Guo, Jiaqi, Liu, Jinshui, Shen, Wenlong, Li, Na, Xu, Guangchen

“…The Lishui Sag is located in the southeastern part of the Taibei Depression, in the East China Sea basin, where the sag is the major hydrocarbon accumulation…”
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Special equipment for processing inner holes in bending section of the main pipeline in nuclear power plant by Zhang, Wenwu, Wang, Jingbo, Xu, Guangchen, Qian, Lin

“…Because of the special forging material and complex pipe structure of the main pipe of the AP1000 nuclear power plant, a single general equipment can not meet…”
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Electromigration-induced Bi-rich whisker growth in Cu/Sn–58Bi/Cu solder joints by He, Hongwen, Xu, Guangchen, Guo, Fu

“…Effect of current stressing on whisker growth in Cu/Sn–58Bi/Cu solder joints was investigated with current densities of 5 × 10 3 and 10 4  A/cm 2 in oven at…”
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Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach by Xu, Guangchen, Guo, Fu, Wang, Xitao, Xia, Zhidong, Lei, Yongping, Shi, Yaowu, Li, Xiaoyan

“…▶ We used a revised solder joints with one-dimension geometry that can help us to investigate the true failure mechanisms of solder joints induced by EM. ▶ One…”
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Bi Layer Formation at the Anode Interface in Cu/Sn-58Bi/Cu Solder Joints with High Current Density by He, Hongwen, Zhao, Haiyan, Guo, Fu, Xu, Guangchen

“…Bi layer formation in Cu/Sn-58Bi/Cu solder joints was investigated with different current densities and solder thickness. Uniform and continuous Bi layers were…”
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Electromigration in Sn-Bi Modified with Polyhedral Oligomeric Silsesquioxane by Zhang, Ruihong, Xu, Guangchen, Wang, Xitao, Guo, Fu, Lee, Andre, Subramanian, K. N.

“…Electromigration (EM) behavior of eutectic Sn-Bi modified with cage-type polyhedral oligomeric silsesquioxane (POSS) trisilanol was investigated. A direct…”
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Effect of rare earth on mechanical creep–fatigue property of SnAgCu solder joint by Xiao, WeiMin, Shi, YaoWu, Xu, GuangChen, Ren, Ren, Guo, Fu, Xia, ZhiDong, Lei, YongPing

“…In this paper, the effects of rare earth (RE) element additions on the mechanical creep–fatigue property of the Sn3.8Ag0.7Cu solder joint have been…”
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Effect of Ca addition and heat treatment on the A390(S)/AM60(L) interface microstructure by Ma, Likun, Chen, Yiqing, Liu, Lihua, Su, Yong, Xu, Guangchen, Fang, Hongjiao

“…Overcasting is a new kind of dissimilar joining technique used to produce the aluminum(solid)/magnesium(liquid) bonding bi-metallic material in this study. For…”
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The Evolution of Sensory Science: Expanding the Frontiers of the Flavour and Fragrance Journal by Chai, Renjie, Xu, Guangchen

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Joule heating effect on oxide whisker growth induced by current stressing in Cu/Sn-58Bi/Cu solder joint by He, Hongwen, Cao, Liqiang, Wan, Lixi, Zhao, Haiyan, Xu, Guangchen, Guo, Fu

“…The electromigration test was conducted in Cu/Sn-58Bi/Cu solder joint with high current density of 10 4 A/ cm 2 . Results showed that a large number of…”
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Effects of Processing and Amount of Co Addition on Shear Strength and Microstructual Development in the Sn-3.0Ag-0.5Cu Solder Joint by Ma, Limin, Tai, Feng, Xu, Guangchen, Guo, Fu, Wang, Xitao

“…Due to its high Young’s modulus and strong bond with Sn, Co has been considered as one of the most promising alloying elements to improve the strength and…”
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Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration by Guo, Fu, Xu, Guangchen, Sun, Jia, Xia, Zhidong, Lei, Yongping, Shi, Yaowu, Li, Xiaoyan

“…The resistance of electronic interconnects made with Sn-based solders experiences significant deterioration during service in high-performance electronic…”
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