Search Results - "Xie, J. D."

Unconventional exciton evolution from the pseudogap to superconducting phases in cuprates by Singh, A., Huang, H. Y., Xie, J. D., Okamoto, J., Chen, C. T., Watanabe, T., Fujimori, A., Imada, M., Huang, D. J.

“…Electron quasiparticles play a crucial role in simplifying the description of many-body physics in solids with surprising success. Conventional Landau’s…”
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Prognostic relevance and therapeutic implications of centromere protein F expression in patients with esophageal squamous cell carcinoma by Mi, Y.-J., Gao, J., Xie, J.-D., Cao, J.-Y., Cui, S.-X., Gao, H.-J., Yao, S.-P., Liu, T., Zhang, Y.-Y., Guo, C.-H., Qiu, G.-Q., Chen, Y.-Q.

“…Summary Centromere protein F (CENP‐F), a cell cycle‐regulated centromere protein, has been shown to affect numerous tumorigenic processes. This study aimed to…”
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Resonant inelastic X-ray scattering as a probe of Jeff = 1/2 state in 3d transition-metal oxide by Huang, H. Y., Singh, A., Wu, C. I., Xie, J. D., Okamoto, J., Belik, A. A., Kurmaev, E., Fujimori, A., Chen, C. T., Streltsov, S. V., Huang, D. J.

“…The state with effective total moment J eff  = 1/2 stabilized by the spin-orbit coupling is known to suppress Jahn-Teller distortions and may induce a strong…”
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A novel soldering method to evaluate PCB pad cratering for pin-pull testing by Cai, M., Xie, D.J., Chen, W.B., Wu, B.Y., Yang, D.G., Zhang, G.Q.

“…•We propose a novel pin-pull test method to simplify pin soldering.•The method only requires a common tensile tester with widely available pins.•The proposed…”
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Characterization of a hospital-based gastroenteritis outbreak caused by GII.6 norovirus in Jinshan, China by Zhang, X. F., Chen, J. R., Song, C. L., Xie, D. J., Tan, M., Wang, L., Koroma, M. M., Hou, Y. Z., Dong, Z. P., Yu, J. R., Duan, W. T., Zhao, D. D., Du, J. R., Zhu, L., Dai, Y. C.

“…An acute gastroenteritis (AGE) outbreak caused by a norovirus occurred at a hospital in Shanghai, China, was studied for molecular epidemiology, host…”
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Resonant inelastic X-ray scattering as a probe of J eff = 1/2 state in 3d transition-metal oxide by H. Y. Huang, A. Singh, C. I. Wu, J. D. Xie, J. Okamoto, A. A. Belik, E. Kurmaev, A. Fujimori, C. T. Chen, S. V. Streltsov, D. J. Huang

“…Abstract The state with effective total moment J eff = 1/2 stabilized by the spin-orbit coupling is known to suppress Jahn-Teller distortions and may induce a…”
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A new experimental method to evaluate creep fatigue life of flip-chip solder joints with underfill by Xie, D.J.

“…A new accelerated stress test method was developed to evaluate creep life of flip-chip solder joints with underfill. With this method, a cyclic creep test can…”
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Clinical analysis of the combination regimen with Bcl-2 inhibitor venetoclax in the treatment of 30 cases of acute myeloid leukemia with IDH1/2 mutation by Wang, X, Bao, X B, Zhang, J, Song, B Q, Li, M Y, Xie, J D, Shen, H J, Wu, D P, Qiu, H Y

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Characteristics of porosity in solder pastes during infrared reflow soldering by CHAN, Y. C, XIE, D. J, LAI, J. K. L

“…The effects of solder pastes and infrared reflow temperature profiles on the characteristics of porosity in solder joints are described. Porosity in solder…”
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Process capability study and thermal fatigue life prediction of ceramic BGA solder joints by Xie, D.J, Wang, Z.P

“…The design and process capability of board-level assembly of ceramic ball grid array (CBGA) packages with respect to their reliabilities were investigated. Two…”
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Experimental studies of pore formation in surface mount solder joints by Chan, Y.C., Xie, D.J., Lai, J.K.L.

“…This paper reports some new experimental findings and theoretical analyses on the pore formation in surface mount solder joints fabricated using conventional…”
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JAK2V617F mutation and BCR-ABL fusion gene positive myeloproliferative neoplasm: two case report by Wang, Y, Pan, J L, Shen, J, Zhang, J, Bai, S X, Gong, Y L, Wu, C X, Cen, J N, Yao, L, Shen, H J, Xie, J D, Chen, S N, Qiu, H C

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Exciton dynamics uncovering electron fractionalization in superconducting cuprates by Singh, A, Huang, H. Y, Xie, J. D, Okamoto, J, Chen, C. T, Watanabe, T, Fujimori, A, Imada, M, Huang, D. J

“…Nature Communications volume 13, Article number: 7906 (2022) Electron quasiparticles play a crucial role in simplifying the description of many-body physics in…”
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Multi-objective transmission network planning by a hybrid GA approach with fuzzy decision analysis by Chung, T.S., Li, K.K., Chen, G.J., Xie, J.D., Tang, G.Q.

“…In this paper, power system transmission network planning is formulated as a multi-objective mathematical optimization problem. In this context, three…”
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Surface element segregation and electrical conductivity of lithium layered transition-metal oxide cathode materials by Li, Guohua, Li, Qi, Li, Liping, Fan, Jianming, Ge, Qingqin, Xie, Dongjiu, Zheng, Jing, Li, Guangshe

“…•Surface element segregation is uncovered for layered transition-metal oxides.•Ni/Mn atoms enrich in surface region, while Co atoms show anti-segregation.•TMs…”
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Fatigue life estimation of surface mount solder joints by Xie, D.J., Chan, Y.C., Lai, J.K.L., Hui, I.K.

“…A novel and direct method to measure the stress-strain properties of surface mount solder joints is proposed in this paper. The specimen used in the…”
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An experimental approach to pore-free reflow soldering by Xie, D.J., Chan, Y.C., Lai, J.K.L.

“…This paper addresses the mechanism of pore growth and reports the results of an investigation on pore-free reflow soldering. An experimenting approach to…”
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Fatigue life studies on defect-free solder joints fabricated from modified reflow soldering by Xie, D.J., Chan, Y.C., Lai, J.K.L., Hui, I.K.

“…This paper describes the improved characteristics of defect-free solder joints fabricated through modified reflow soldering. The modified method only requires…”
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Application of direct strain measurement to fatigue studies in surface solder joints by Chan, Y.C., Xie, D.J., Lai, J.K.L., Hui, I.K.

“…A direct method to measure the fatigue life of surface mount solder joints is proposed. This approach makes use of a quad flat pack (QFP) solder-printed…”
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Investigation on PCB pad strength by Cai, M, Xie, D J, Zhang, Z, Hu, Billy, Su, X X, Tao, Y, Wu, B Y

“…In this paper, a pin pull test is introduced as an effective way to assess the PCB pad strength. The pad strength is evaluated by different level of strain,…”
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