Search Results - "Xiaowu, Hu"

Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints by Wang, Haozhong, Hu, Xiaowu, Jiang, Xiongxin

“…A composite solder was prepared by adding different amount Ni modified multi-walled carbon nanotubes (MWCNTs) into the Sn-3.0Ag-0.5Cu (SAC305) solder…”
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Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints by Zhang, Zhe, Hu, Xiaowu, Jiang, Xiongxin, Li, Yulong

“…The interfacial microstructures of Sn-3.0Ag-0.5Cu (SAC305) solder systems with thin Ni(P) mono-coatings and Cu-Ni(P) dual-coatings were investigated after…”
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Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux by Wang, Haozhong, Hu, Xiaowu, Jiang, Xiongxin, Li, Yulong

“…•The carbon nanotube was successfully modified with Cu nanoparticles.•A composite flux was prepared by doping Cu-CNTs into flux.•The growth of IMC layer was…”
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Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints by Hu, Xiaowu, Xu, Tao, Keer, Leon M., Li, Yulong, Jiang, Xiongxin

“…The effect of isothermal aging on the microstructure and shear strength of Sn3Ag0.5Cu/Cu (SAC305/Cu) solder joints were studied systematically. The single-lap…”
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Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification by Hu, Xiaowu, Li, Yulong, Liu, Yi, Min, Zhixian

“…•The Sn0.7Cu–xBi solder alloys were directionally solidified.•Both spacing and diameter of fibers decreased with increasing solidification rate.•The UTS and YS…”
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The geography of intercity technological proximity: evidence from China by Yingcheng, Li, Weiting, Xiong, Xiaowu, Hu

“…In the context of a globalizing knowledge economy, cities have become more technologically proximate due to the increasing exchanges of people, information,…”
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Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging by Hu, Xiaowu, Li, Yulong, Min, Zhixian

“…•The Bi-containing Sn0.7Cu/Cu soldered joints were prepared by reflowing.•Growth of the interfacial IMC layer was accelerated by Bi addition.•The interfacial…”
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Effects of rare earth Er additions on microstructure development and mechanical properties of die-cast ADC12 aluminum alloy by Hu, Xiaowu, Jiang, Fugang, Ai, Fanrong, Yan, Hong

“…► The α-Al dendrite and the eutectic Si were significantly refined by adding Er. ► The Hv of alloys first increased with increasing Er content, then decreases…”
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Effects of ultrasonic treatment on mechanical properties and microstructure evolution of the Cu/SAC305 solder joints by Hu, Xiaowu, Xu, Han, Chen, Wenjing, Jiang, Xiongxin

“…The effects of different ultrasonic treatment time on microstructure evolution and mechanical property of Cu/Sn-3.0Ag-0.5Cu (SAC305) solder joints were…”
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Form-stable phase change materials enhanced photothermic conversion and thermal conductivity by Ag-expanded graphite by Luo, Wenxing, Hu, Xiaowu, Che, Yinhui, Zu, Shuai, Li, Qinglin, Jiang, Xiongxin, Liu, Dingjun

“…Phase change materials (PCMs), which exhibit significant capacity of latent heat absorption and release during the phase change process, have been promisingly…”
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Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux by Gui, Zixiao, Hu, Xiaowu, Jiang, Xiongxin, Li, Yulong, Wang, Haozhong

“…This paper aims to investigate the influence of composite flux on the interfacial reaction, wettability, and shear strength evolution of Sn-3.0Ag-0.5Cu…”
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Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging by Li, Yulong, Long, Weifeng, Hu, Xiaowu, Fu, Yanshu

“…In order to accelerate the growth of interfacial intermetallic compound (IMC) layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot…”
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Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging by Hu, Xiaowu, Li, Yulong, Liu, Yong, Liu, Yi, Min, Zhixian

“…•The formation of Cu–Sn IMC is mainly controlled by the diffusion mechanism.•The reflowed solder joint had better shear strength than the aged solder…”
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Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: A recent review by Wang, Jianing, Chen, Jieshi, Zhang, Lixia, Zhang, Zhiyuan, Han, Yuzhu, Hu, Xiaowu, Lu, Hao, Zhang, Shuye

“…For the common Cu-Sn interconnection system in microelectronics packaging, a significant concern is the sporadic interfacial void formation within the Cu–Sn…”
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Microstructure evolution and mechanical properties of Sn0.7Cu0.7Bi lead-free solders produced by directional solidification by Hu, Xiaowu, Li, Ke, Min, Zhixian

“…•The Sn0.7Cu0.7Bi solder alloy was directionally solidified.•Both inter-fiber spacing and fiber diameter decrease with increasing growth rate.•The UTS and YS…”
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Mechanical performance of aligned electrospun polyimide nanofiber belt at high temperature by Jiang, Shaohua, Duan, Gaigai, Chen, Linlin, Hu, Xiaowu, Hou, Haoqing

“…High mechanical performance materials at high temperature are highly desired for the materials used in high temperature industries. This study reports the…”
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Microstructure and tensile properties of Sn–1Cu lead-free solder alloy produced by directional solidification by Hu, Xiaowu, Chen, Wenjing, Wu, Bin

“…Cu6Sn5 fiber reinforced Sn in situ composites with a nominal composition Sn–1Cu (wt%) were produced by specially controlled directional solidification using a…”
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Intracranial hemorrhage risk factors of deep brain stimulation for Parkinson’s disease: a 2-year follow-up study by Yang, Chunhui, Qiu, Yiqing, Wang, Jiali, Wu, Yina, Hu, Xiaowu, Wu, Xi

“…Objective This study aimed to analyze the risk factors of intracranial hemorrhage (ICH) after deep brain stimulation (DBS) for idiopathic Parkinson’s disease…”
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Growth behavior of IMCs layer of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu substrates during aging by Li, Yulong, Wang, Zhiliang, Li, Xuewen, Hu, Xiaowu, Lei, Min

“…In this work, the interfacial reactions and IMC growth of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu were studied during reflowing at 220 °C for 10 min and…”
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MXene-decorated bio-based porous carbon composite phase change material for superior solar-thermal energy storage and thermal management of electronic components by Chen, Wenjing, Xiao, Shikun, Liu, Yi, Hu, Xiaowu, Xie, Yuqiong, Liu, Yichi, Ma, Yan, Luo, Lixiang, Jiang, Xiongxin

“…Energy storage technology based on phase change materials (PCM) can effectively solve the problem of poor energy utilization. However, PCM suffer from problems…”
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