Search Results - "Xian, J. W"

The role of microstructure in the thermal fatigue of solder joints by Xian, J. W., Xu, Y. L., Stoyanov, S., Coyle, R. J., Dunne, F. P. E., Gourlay, C. M.

“…Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the…”
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Time-Lapse Imaging of Ag3Sn Thermal Coarsening in Sn-3Ag-0.5Cu Solder Joints by Xian, J. W., Belyakov, S. A., Gourlay, C. M.

“…The coarsening of Ag 3 Sn particles occurs during the operation of joints and plays an important role in failure. Here, Ag 3 Sn coarsening is studied at 125°C…”
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Ag3Sn Morphology Transitions During Eutectic Growth in Sn–Ag Alloys by Hou, N., Xian, J. W., Sugiyama, A., Yasuda, H., Gourlay, C. M.

“…Eutectic Ag 3 Sn can grow with a variety of morphologies depending on the solidification conditions and plays an important role in the performance of Pb-free…”
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Nucleation and Growth of Tin in Pb-Free Solder Joints by Gourlay, C. M., Belyakov, S. A., Ma, Z. L., Xian, J. W.

“…The solidification of Pb-free solder joints is overviewed with a focus on the formation of the β Sn grain structure and grain orientations. Three solders…”
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Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony by Belyakov, S. A., Coyle, R. J., Arfaei, B., Xian, J. W., Gourlay, C. M.

“…Antimony is attracting interest as an addition to Pb-free solders to improve thermal cycling performance in harsher conditions. Here, we investigate…”
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In situ imaging of microstructure formation in electronic interconnections by Salleh, M. A. A. Mohd, Gourlay, C. M., Xian, J. W., Belyakov, S. A., Yasuda, H., McDonald, S. D., Nogita, K.

“…The development of microstructure during melting, reactive wetting and solidification of solder pastes on Cu-plated printed circuit boards has been studied by…”
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The Influence of Primary Cu6Sn5 Size on the Shear Impact Properties of Sn-Cu/Cu BGA Joints by Li, Z. Q., Belyakov, S. A., Xian, J. W., Gourlay, C. M.

“…A method is presented to control the size of primary Cu 6 Sn 5 in ball grid array (BGA) joints while keeping all other microstructural features near-constant,…”
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Nucleation of tin on the Cu6Sn5 layer in electronic interconnections by Xian, J.W., Ma, Z.L., Belyakov, S.A., Ollivier, M., Gourlay, C.M.

“…A Cu6Sn5 layer is an integral part of many electronic interconnections. Here we show that, although primary Cu6Sn5 is not a potent nucleant for Sn, the Cu6Sn5…”
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Facets Formation of Ag3Sn Intermetallic in Sn-Bi-Ag Alloys: An EBSD and First-Principles Study by Liao, J. L., Hu, X. J., Wang, Y. R., Sun, W., Mi, G. Y., Xian, J. W., Zeng, G.

“…Ag 3 Sn intermetallic growth within Sn-Bi-Ag alloys during relatively slow cooling rates has a pronounced effect on the performance and reliability of solder…”
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Al8Mn5 in High-Pressure Die Cast AZ91: Twinning, Morphology and Size Distributions by Zeng, G., Shuai, S. S., Zhu, X. Z., Ji, S. X., Xian, J. W., Gourlay, C. M.

“…Manganese-bearing intermetallic compounds (IMCs) are important for limiting micro-galvanic corrosion of magnesium-aluminum alloys and can initiate cracks under…”
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Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints by Belyakov, S.A., Xian, J.W., Sweatman, K., Nishimura, T., Akaiwa, T., Gourlay, C.M.

“…The improvement of solder joint mechanical performance due to bismuth additions is of ongoing interest. This paper investigates the influence of 0–14 wt% Bi on…”
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Gastrodia-Uncaria water extract and tissue plasminogen activator for treating embolus-induced cerebral ischaemia: abridged secondary publication by Xian, J W, Choi, A Y T, Leung, W N, Li, L, Lau, C B S, Leung, T W H, Chan, C W

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Nucleation and growth crystallography of Al8Mn5 on B2-Al(Mn,Fe) in AZ91 magnesium alloys by Zeng, G., Xian, J.W., Gourlay, C.M.

“…Manganese is widely added to Mg-Al-based alloys to form Al-(Mn,Fe) intermetallics that combat impurity Fe. Here EBSD, deep etching and FIB-tomography are…”
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Microstructure evolution and deformation behaviour of Sn-xBi-1Ag Solder alloys: Influences of Bi content by Hu, X.J., Sun, W., Liao, J.L., Xian, J.W., Zeng, G.

“…The study of microstructural evolution in ternary Sn–Bi–Ag solder alloys is critical due to its direct impact on the mechanical properties of these…”
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Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys by Cui, Y., Xian, J.W., Zois, A., Marquardt, K., Yasuda, H., Gourlay, C.M.

“…Large Ag3Sn plates in solder joints can affect the reliability of electronics, however, the factors affecting their nucleation and morphology are not well…”
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Eutectic solidification in Mg-9Al-0.7Zn: From divorced to coupled growth by Lin, C.J., Peng, L., Xian, J.W., Li, Q., Gourlay, C.M.

“…In hypoeutectic Mg-Al-based alloys, Mg17Al12 forms in the last stages of solidification by a eutectic reaction that is usually fully or partially divorced…”
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Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections by Xian, J.W., Belyakov, S.A., Ollivier, M., Nogita, K., Yasuda, H., Gourlay, C.M.

“…The growth mechanisms of primary Cu6Sn5 are studied in Sn-Cu alloys and solder joints by combining EBSD, FIB-tomography and synchrotron radiography. With…”
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Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn by Xian, J.W., Zeng, G., Belyakov, S.A., Gu, Q., Nogita, K., Gourlay, C.M.

“…The directional coefficient of thermal expansion (CTE) of intermetallics in electronic interconnections is a key thermophysical property that is required for…”
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Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds by Ma, Z.L., Xian, J.W., Belyakov, S.A., Gourlay, C.M.

“…βSn nucleation is a key step in the formation of microstructure in electronic solder joints. Here, the heterogeneous nucleation of βSn is studied in…”
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Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying by Xian, J. W., Belyakov, S. A., Gourlay, C. M.

“…We show that dilute Al additions can control the size of primary Cu 6 Sn 5 rods in Sn-0.7Cu/Cu ball grid array joints. In Sn-0.7Cu-0.05Al/Cu joints, the number…”
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