Search Results - "Wurst, Helge"

Adhesive Strength and Diffusion at Interfaces between Sintered Cu Layer and Metal Surfaces (Cu, Ag, Au, Pd, Pt, Ni, NiPx, and NiBx) by Ishikawa, Dai, Nakako, Hideo, Blank, Thomas, Wurst, Helge, Steiner, Felix

“…Die-bonding technology using a sintering reaction of Cu nanoparticles at low temperatures is an attractive and important joint method for power devices…”
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Effect of Sintering Temperature for Die-shear Strength of Non-pressure Sintering Copper Paste on Metal Plating by Ishikawa, Dai, Blank, Thomas, Wurst, Helge, Steiner, Felix, Nakako, Hideo

“…Die-bonding technology using Cu sinter pastes is an attractive and important joint method for power devices operating at higher temperatures. This paper…”
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Reliability of Silicone and Epoxy Resin Encapsulated Power Modules in HV-H3TRB tests with Thin-Resin coated Dice by Steiner, Felix, Wurst, Helge, Leyrer, Benjamin, Ishikawa, Dai, Nakako, Hideo, Blank, Thomas

“…Soft silicone gels, as the standard potting materials for power electronic modules, provide little protection against water ingress and thus cannot protect the…”
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Copper sintered Si3N4 Power Modules in Thermal Shock Tests by Blank, Thomas, Zhang, Hongpeng, Wurst, Helge, Leyrer, Benjamin, Steiner, Felix, Ishikawa, Dai, Geckele, Udo, Peric, Ivan

“…The mechanical behavior of Al 2 O 3 -DCB and Si 3 N 4 -AMB power modules comprising copper sintered SiC-and Si-dice in liquid to liquid thermal shock cycles…”
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Die-attach Properties of Pressure-sintered Copper Joints on Adhesive Metallization Surfaces in N2 Atmosphere by Ishikawa, Dai, An, Bao Ngoc, Mail, Matthias, Wurst, Helge, Leyrer, Benjamin, Blank, Thomas, Weber, Marc, Nakako, Hideo

“…Die-attach properties of mechanical pressure-assisted sintered copper (pressure-sintered Cu) on some metallization layers in N2 atmosphere for high-power…”
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GaAs Diode Rectifier Power Module in mixed Ag- and Large Area Cu-Sintering Technology for Ultra-Fast and Wireless Electric Vehicle Battery Charging by Blank, Thomas, Dudek, Volker, Luh, Matthias, An, Bao Ngoc, Wurst, Helge, Leyrer, Benjamin, Ishikawa, Dai, Weber, Marc

“…This paper describes the properties of GaAs PIN power diodes and demonstrates their utilization in a 650V 10kW LLC converter for fast charging of electric…”
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Analysis of Bonding Interfaces of Pressureless-sintered Cu on Metallization Layers by Ishikawa, Dai, An, Bao Ngoc, Mail, Matthias, Wurst, Helge, Leyrer, Benjamin, Blank, Thomas, Weber, Marc, Ueda, Suguru, Nakako, Hideo, Kawana, Yuki

“…this paper describes thermal stabilities (573 K for 8 h) of pressureless-sintered Copper (Cu) on four kinds of top metallization layers (Ni, Cu, Ag, and Au) by…”
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A highly integrated copper sintered SiC power module for fast switching operation by An, Bao Ngoc, Ishikawa, Dai, Blank, Thomas, Wurst, Helge, Demattio, Horst, Leyrer, Benjamin, Kolb, Johannes, Scherer, Torsten, Simon, Ansgar, Weber, Marc

“…A novel 1200 V and 110 A SiC pin-fin direct cooled six-pack power module with integrated DC-link capacitor and gate driver circuits is presented. The SiC power…”
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Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties by Ishikawa, Dai, Nakako, Hideo, Kawana, Yuki, Sugama, Chie, Negishi, Motohiro, Ejiri, Yoshinori, Ueda, Suguru, An, Bao Ngoc, Wurst, Helge, Leyrer, Benjamin, Blank, Thomas, Weber, Marc

“…this paper describes the sintering properties and bonding properties of copper (Cu) die-bonding sinter paste for power devices operating at high temperatures…”
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