Search Results - "Wu, Mouxin"

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  1. 1

    Effects of Zn/Ga ratio on microstructure, mechanical, damping and thermal properties of Mg–Zn–Ga alloy solid solutions by He, Jiale, Chen, Jihua, Yan, Hongge, Xia, Weijun, Su, Bin, Sun, Youping, Nie, Yang, Huang, Wensen, Wu, Mouxin

    Published in Journal of materials research (28-05-2022)
    “…Effects of Zn/Ga ratio on microstructure, mechanical, damping and thermal properties of Mg– x Zn– y Ga ( x  +  y  = 1 at.%, x / y  = 3:1,1:1,1:3, x or y  = 0)…”
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    Journal Article
  2. 2

    High Strength-Thermal Conductivity Mg–Ga–Ca–Ce Sheet by Hot-Extrusion and Rolling by Wu, Mouxin, Jiang, Xueqi, Chen, Jihua, Yan, Hongge, Xia, Weijun, Su, Bin, Deng, Yifu

    “…The thermal conductivity of magnesium alloys is increasingly required for fast heat dissipation in the automotive and electronic fields. However, the methods…”
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    Journal Article
  3. 3

    Effect of Ca addition on the mechanical properties and thermal conductivity of Mg-2Ga alloy by Wu, Mouxin, Chen, Jihua, Yan, Hongge, Xia, Weijun, Su, Bin, Deng, Yifu, Shen, Yu

    “…The Ca concentration dependence of microstructure, mechanical properties and thermal conductivity of Mg-2Ga-xCa (x = 0, 0.2, 0.4 and 0.8, in wt.%) alloys has…”
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  4. 4

    Enhancing strength and ductility of low RE content Mg-Gd-Y-Zr alloy via a novel thermomechanical treatment based on multi-directional forging by Deng, Yifu, Yan, Hongge, Li, Qiang, Chen, Jihua, Xia, Weijun, Su, Bin, Wu, Mouxin, Yu, Yangbo, Song, Min

    Published in Journal of alloys and compounds (05-10-2023)
    “…The high strength of most Mg-RE alloys is frequently accomplished by high RE addition, but their high density and poor plasticity restrict their applications…”
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    Journal Article
  5. 5

    High Strength-Thermal Conductivity Mg–Ga–Ca–Ce Sheet by Hot-Extrusion and Rolling by Mouxin Wu, Xueqi Jiang, Jihua Chen, Hongge Yan, Weijun Xia, Bin Su, Yifu Deng

    Published in Metals and materials international (01-01-2024)
    “…The thermal conductivity of magnesium alloys is increasingly required for fast heat dissipation in the automotive and electronicfields. However, the methods…”
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    Journal Article