Search Results - "Woopoung Kim"
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Estimation of Simultaneous Switching Noise From Frequency-Domain Impedance Response of Resonant Power Distribution Networks
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-09-2011)“…Simultaneous switching noise can significantly impact the performance of high-speed systems and needs to be accurately analyzed. The simulation program with…”
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2
Design of inductors in organic substrates for 1-3 GHz wireless applications
Published in 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278) (2002)“…High Q inductors with maximum quality factors in the range of 180-60 have been obtained at frequencies in the 1-3 GHz band for inductances in the range of 1 nH…”
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Conference Proceeding Journal Article
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3
Characterization of Co-Planar Silicon Transmission Lines With and Without Slow-Wave Effect
Published in IEEE transactions on advanced packaging (01-08-2007)“…Co-planar lines on silicon substrates with and without slow-wave effect are characterized using time-domain reflectometry (TDR) and vector network analyzer…”
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4
Simulation of lossy package transmission lines using extracted data from one-port TDR measurements and nonphysical RLGC models
Published in IEEE transactions on advanced packaging (01-11-2005)“…In this paper, the frequency-dependent characteristic impedance and propagation constant of lossy transmission lines have been extracted from one-port…”
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Accurate Characterization of Broadband Multiconductor Transmission Lines for High-Speed Digital Systems
Published in IEEE transactions on advanced packaging (01-11-2010)“…Accurate modeling of transmission lines becomes increasingly important in high-speed interconnect system design. However, it is rather difficult to obtain…”
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The Applications of Simulation and Artificial Intelligence in Advanced Packaging
Published in 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (15-07-2024)“…Advanced Packaging enables the heterogenous integration of chiplets with die embedding and die stacking techniques, and provides maximum device performance…”
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Conference Proceeding -
7
Optimizing the timing center for high-speed parallel buses
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01-05-2012)“…As data rates continue to increase, the quality of the transmitted signal is not the only important factor in the design of modern high-speed I/O interfaces;…”
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Conference Proceeding -
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High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm
Published in IEEE transactions on components and packaging technologies (01-09-2000)“…This paper firstly reports on the high-frequency SPICE model of the ACF flip-chip interconnections up to 13 GHz. The extraction process is based on an…”
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Performance Impact of Simultaneous Switching Output Noise on Graphic Memory Systems
Published in 2007 IEEE Electrical Performance of Electronic Packaging (01-10-2007)“…Simultaneous switching output noise (SSO) in single-ended signaling systems is one of the major performance limiters as data rate scales higher. This paper…”
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Conference Proceeding -
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S-parameters Based Transmission Line Modeling with Accurate Low-Frequency Response
Published in 2006 IEEE Electrical Performane of Electronic Packaging (01-10-2006)“…Accurate transmission line modeling is required for multi-gigahertz designs. To capture high frequency effects such as frequency-dependent dielectric and…”
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Conference Proceeding -
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Pseudo-differential signaling scheme based on 4b/6b multiwire code
Published in 2008 IEEE-EPEP Electrical Performance of Electronic Packaging (01-10-2008)“…The majority of todaypsilas memory interfaces use single-ended signaling instead of differential signaling. Extending the performance of single-ended systems…”
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Conference Proceeding -
12
Thermal and mechanical simulations of 3D packages with custom high bandwidth memory (HBM)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28-05-2024)“…Custom high bandwidth memory (HBM) directly connects the DRAM die stacks to the logic die vertically. The bottom logic die functions as both the logic and the…”
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Conference Proceeding -
13
Determination of propagation constants of transmission lines using 1-port TDR measurements
Published in 59th ARFTG Conference Digest, Spring 2002 (2002)“…The propagation constants of transmission lines were measured from 1-port TDR measurements. Since the TDR measurement is a 1-port measurement, error can be…”
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Conference Proceeding -
14
Suppression of coupled-slotline mode on CPW using air-bridges measured by picosecond photoconductive sampling
Published in IEEE microwave and guided wave letters (01-07-1999)“…For the first time, the effect of air-bridges on the suppression of the unwanted coupled-slotline (CSL) mode on a coplanar waveguide (CPW) is experimentally…”
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Extraction of the frequency-dependent characteristic impedance of transmission lines using TDR measurements
Published in Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) (2000)“…This paper discusses a method for measuring the frequency-dependent characteristic impedance of transmission lines using time domain reflectometry (TDR)…”
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Conference Proceeding -
16
Capturing via effects in simultaneous switching noise simulation
Published in 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161) (2001)“…This paper presents a method for including via effects in modeling simultaneous switching noise (SSN). Models for interconnections and multi-layered planes…”
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Conference Proceeding -
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A novel time domain picosecond pulse sampling system for noncontact characterization of liquids, semiconductors, and metals
Published in Technical Digest. CLEO/Pacific Rim '99. Pacific Rim Conference on Lasers and Electro-Optics (Cat. No.99TH8464) (1999)“…We firstly introduce a novel picosecond pulse sampling system with pulse beam paths in which the pulse is incident normally to the surface of the material…”
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Conference Proceeding -
18
Electromagnetic modelling of switching noise in on-chip power distribution networks
Published in 8th International Conference on Electromagnetic Interference and Compatibility (2003)“…An investigation of the effect of substrate loss on simultaneous switching noise (SSN) in on-chip power distribution networks is presented. In order to…”
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Conference Proceeding -
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Picosecond pulse scattering of highly-polarized electromagnetic wave measured by photoconductive sampling
Published in Technical Digest. CLEO/Pacific Rim '99. Pacific Rim Conference on Lasers and Electro-Optics (Cat. No.99TH8464) (1999)“…The scaled-down electromagnetic scattering experiment based on the terahertz pulse generation and detection using dioramas has been suggested as one of the…”
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Conference Proceeding -
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100 GHz time domain measurement using photoconductive sampling
Published in 1998 IEEE Sixth International Conference on Terahertz Electronics Proceedings. THZ 98. (Cat. No.98EX171) (1998)“…Photoconductive sampling has been proposed as a potent technique for analyzing high frequency devices and systems, using the photoconductive sampling. The…”
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Conference Proceeding