Search Results - "Wollitzer, M."

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  1. 1

    Contactless Vector Network Analysis With Printed Loop Couplers by Zelder, T., Geck, B., Wollitzer, M., Rolfes, I., Eul, H.

    “…In this paper, an introduction to contactless vector network analysis is given. Furthermore, the implementation of a contactless measurement setup is presented…”
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    Journal Article Conference Proceeding
  2. 2

    Multifunctional radar sensor for automotive application by Wollitzer, M., Buechler, J., Luy, J.-F., Siart, U., Schmidhammer, E., Detlefsen, J., Esslinger, M.

    “…A multifunctional radar system for vehicles consisting of two modules with a combined bistatic/monostatic arrangement is presented. One module acts as a…”
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    Journal Article
  3. 3

    Si/SiGe MMIC's by Luy, J.-F., Strohm, K.M., Sasse, H.-E., Schuppen, A., Buechler, J., Wollitzer, M., Gruhle, A., Schaffler, F., Guettich, U., Klaassen, A.

    “…Silicon-based millimeter-wave integrated circuits (SIMMWIC's) can provide new solutions for near range sensor and communication applications in the frequency…”
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    Journal Article
  4. 4

    Self-packaged millimeter-wave Si-IMPATT diodes by Luschas, M., Wollitzer, M., Luy, J.-F.

    “…This paper presents a technology process, which integrates diode and housing in a self-packaged millimeter-wave Si-IMPATT device. The housing consists of a…”
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    Conference Proceeding
  5. 5

    A new technology process for packaged millimeter-wave Si-IMPATT diodes by Luschas, M., Wollitzer, M., Luy, J.-F.

    “…This paper presents a technology process which integrates a diode and its housing in a packaged millimeter-wave Si-IMPATT device. The housing consists of a…”
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    Conference Proceeding
  6. 6

    Addressing the Broadband Crosstalk Challenges of Pogo Pin Type Interfaces for High-Density High-Speed Digital Applications by Szendrenyi, B.B., Barnes, H., Moreira, J., Wollitzer, M., Schmid, T., Ming Tsai

    “…Input-output (I/O) cells in integrated circuit devices (ICs) are pushing data-rates to speeds of 5 Gb/s and above with an ever increasing number of pins. This…”
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    Conference Proceeding
  7. 7

    Signal Integrity Analysis of a 1.5 Gbit/s LVDS Video Link by Zwillich, V., Wollitzer, M., Wirschem, T., Menzel, W., Leier, H.

    “…Future applications in luxury class cars may require digital video transmission with data rates as high as 1.5 Gbit/s. The signal integrity of an LVDS…”
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    Conference Proceeding
  8. 8

    High efficiency planar oscillator with RF power of 100 mW near 140 GHz by Wollitzer, M., Buechler, J., Luy, J.-F.

    “…An integrated planar oscillator on a high resistivity silicon substrate generates an RF-power of 100 mW in D-band with a peak efficiency of 4.5%. The single…”
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    Conference Proceeding
  9. 9

    Verification of Feed-Through Configurations by Means of Simple Test Apparatus on Component Level by Schmid, T., Wollitzer, M., Halme, L., Mund, B.

    “…Feed-through configurations within high speed data transmission systems can cause serious electromagnetic interference (EMI) problems. A simple test method to…”
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    Conference Proceeding
  10. 10

    New Probing Technology Now Enables Impedance Controlled On-Wafer Probing by Wollitzer, M., Thies, S., Schott, S.

    Published in 2001 31st European Microwave Conference (01-09-2001)
    “…The development of coaxial and planar RF measurement systems demands a completely different approach as currently used in the low frequency field. In order to…”
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    Conference Proceeding
  11. 11

    Development of a pogo pin assembly and via design for multi-gigabit interfaces on automated test equipment by Barnes, H., Moreira, J., Ossoinig, H., Wollitzer, M., Schmid, T., Ming Tsai

    Published in 2006 Asia-Pacific Microwave Conference (01-12-2006)
    “…I/O cells operating up to 10 Gb/s, are now becoming standard blocks in complex integrated circuits (ICs). Integration of these multiple I/O cells in…”
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    Conference Proceeding
  12. 12

    Novel Concept for a Modular Millimeterwave Probe Tip by Wollitzer, M., Rosenberger, B., Strasser, W.

    Published in 55th ARFTG Conference Digest (01-06-2000)
    “…A novel concept for a probe tip is proposed. The signal path along the probe is fully impe dance controlled, resulting in lowest reflec tions…”
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    Conference Proceeding
  13. 13

    Flip-chip mounted silicon-based Impatt diodes for automotive applications by Wollitzer, M., Strohm, K.M., Jorke, H., Luy, J.-F., Rasshofer, R.H., Biebl, E.M.

    “…We present the first silicon-based active antenna based on flip-chip mounted Impatt diodes. Our results show that flip-chip integration of Impatt diodes is a…”
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    Conference Proceeding
  14. 14

    Novel concept for a dual on wafer probe tip and corresponding calibration techniques by Schott, S., Thies, S., Wollitzer, M., Rosenberger, B.

    “…The paper discusses a revolutionary design concept for a dual RFlC wafer probe and corresponding calibration substrates (CSR) which demonstrate perfect…”
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    Conference Proceeding
  15. 15

    Multifunctional millimeter wave radar sensor for vehicle applications by Woilitzer, M., Buchler, J., Luy, J.-F., Start, U., Detlefsen, J.

    “…Important aspects in future automotive concepts are comfort, reduced energy consumption and particularly improved safety. To optimize these points a precise…”
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    Conference Proceeding