Search Results - "Wolansky, Dirk"
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Impact of Temperature on the Resistive Switching Behavior of Embedded \hbox-Based RRAM Devices
Published in IEEE transactions on electron devices (01-09-2011)“…Back-end-of-line integrated 1 × μm 2 TiN/HfO 2 /Ti/TiN MIM memory devices in a 0.25- μm complementary metal-oxide-semiconductor technology were built to…”
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Journal Article -
2
Fast in situ X‐ray analysis of Ni silicide formation
Published in physica status solidi (b) (01-07-2017)“…Metal silicides are the preferred contact materials for metal‐oxide semiconductor (MOS) structures. With further technology development, the materials changed…”
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Journal Article -
3
Impact of Temperature on the Resistive Switching Behavior of Embedded HfO2-Based RRAM Devices
Published in IEEE transactions on electron devices (01-09-2011)Get full text
Journal Article -
4
AlN/SiO2/Si3N4/Si(100)-Based CMOS Compatible Surface Acoustic Wave Filter With −12.8-dB Minimum Insertion Loss
Published in IEEE transactions on electron devices (05-02-2015)“…A CMOS compatible AlN/SiO 2 /Si 3 N 4 /Si(100) surface acoustic wave (SAW) device has been fabricated and will be compared with standard AlN/SiO 2 -based…”
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Journal Article -
5
Contacting graphene in a 200 mm wafer silicon technology environment
Published in Solid-state electronics (01-06-2018)“…[Display omitted] •PECVD of silicon nitride on the graphene was used as the passivation layer.•Two approaches for producing contacts to graphene tested with…”
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6
Optical Stimulation Effects on TiO2 Sensor Dielectric Used in Capacitively-Coupled High-Density CMOS Microelectrode Array
Published in IEEE electron device letters (01-07-2017)“…The effect of optical stimulation of neural tissue is considered in capacitively coupled CMOS microelectrode arrays used for in vitro extracellular recording…”
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7
AlN/SiO 2 /Si 3 N 4 /Si(100)-Based CMOS Compatible Surface Acoustic Wave Filter With −12.8-dB Minimum Insertion Loss
Published in IEEE transactions on electron devices (01-03-2015)Get full text
Journal Article -
8
Optical Stimulation Effects on TiO 2 Sensor Dielectric Used in Capacitively-Coupled High-Density CMOS Microelectrode Array
Published in IEEE electron device letters (01-07-2017)Get full text
Journal Article -
9
SiGe p-n-p HBTs With 265-GHz fmax, 175-GHz fT, and 3.65-ps Gate Delay
Published in IEEE electron device letters (2014)Get full text
Journal Article -
10
SiGe p-n-p HBTs With 265-GHz f max, 175-GHz f T, and 3.65-ps Gate Delay
Published in IEEE electron device letters (01-08-2014)“…SiGe p-n-p heterojunction bipolar transistors (HBTs) are presented with f T /f max values of 175 GHz/265 GHz and a minimum current mode logic ring oscillator…”
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Journal Article -
11
Thermal oxidation of chemical vapour deposited tungsten layers on silicon substrates for embedded non-volatile memory application
Published in Thin solid films (30-06-2009)“…This research is targeted to enhance the functionality of bipolar complementary metal-oxide-semiconductor by innovative concepts of embedded resistive random…”
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12
Wide range tuning of titanium nitride sheet resistance for thin film resistors
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01-05-2017)“…In this paper, a significant extension of the Rs tuning range of sputtered titanium nitride (TiN) layers for thin film resistor (TFR) applications in a…”
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Conference Proceeding -
13
Impact of Temperature on the Resistive Switching Behavior of Embedded hbox HfO 2 -Based RRAM Devices
Published in IEEE transactions on electron devices (01-09-2011)“…Back-end-of-line integrated hbox 1 hbox 1 Unknown character mu hbox m 2 Unknown character hbox TiN / HfO 2 / break hbox Ti / TiN MIM memory devices in a 0.25-…”
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Journal Article -
14
Impact of Temperature on the Resistive Switching Behavior of Embedded [Formula Omitted]-Based RRAM Devices
Published in IEEE transactions on electron devices (01-09-2011)“…Back-end-of-line integrated [Formula Omitted] MIM memory devices in a 0.25-[Formula Omitted] complementary metal-oxide-semiconductor technology were built to…”
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Journal Article -
15
A CMOS-based sensor array for in-vitro neural tissue interfacing with 4225 recording sites and 1024 stimulation sites
Published in 2014 IEEE Biomedical Circuits and Systems Conference (BioCAS) Proceedings (01-10-2014)“…A CMOS-based microelectrode array (MEA) with 4225 recording sites and 1024 stimulation sites and a related data acquisition system are presented. The chip…”
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Conference Proceeding -
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Development of a Through-Silicon Via (TSV) Process Module for Multi-project Wafer SiGe BiCMOS and Silicon Interposer
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01-05-2018)“…In this work, the development of a Through-Silicon Via process module for multi-project wafer SiGe BiCMOS and silicon interposer is demonstrated. The TSV…”
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Conference Proceeding -
17
Three dimensional ALD of TiO2 for in-vivo biomedical sensor applications
Published in 2015 6th International Workshop on Advances in Sensors and Interfaces (IWASI) (01-06-2015)“…Titanium dioxide, known as a high-k biocompatible dielectric transducer material, is processed by means of ALD and applied to a 3D structure with dimensions…”
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Conference Proceeding -
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A modular, low-cost SiGe:C BiCMOS process featuring high-fTand high-BVCEO transistors
Published 2004Get full text
Conference Proceeding