Search Results - "Wolansky, Dirk"

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  1. 1

    Impact of Temperature on the Resistive Switching Behavior of Embedded \hbox-Based RRAM Devices by Walczyk, C., Walczyk, D., Schroeder, T., Bertaud, T., Sowinska, M., Lukosius, M., Fraschke, M., Wolansky, D., Tillack, B., Miranda, E., Wenger, C.

    Published in IEEE transactions on electron devices (01-09-2011)
    “…Back-end-of-line integrated 1 × μm 2 TiN/HfO 2 /Ti/TiN MIM memory devices in a 0.25- μm complementary metal-oxide-semiconductor technology were built to…”
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    Journal Article
  2. 2

    Fast in situ X‐ray analysis of Ni silicide formation by Zaumseil, Peter, Wolansky, Dirk

    Published in physica status solidi (b) (01-07-2017)
    “…Metal silicides are the preferred contact materials for metal‐oxide semiconductor (MOS) structures. With further technology development, the materials changed…”
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    Journal Article
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    AlN/SiO2/Si3N4/Si(100)-Based CMOS Compatible Surface Acoustic Wave Filter With −12.8-dB Minimum Insertion Loss by Kaletta, Udo Christian, Wipf, Christian, Fraschke, Mirko, Wolansky, Dirk, Schubert, Markus Andreas, Schroeder, Thomas, Wenger, Christian

    Published in IEEE transactions on electron devices (05-02-2015)
    “…A CMOS compatible AlN/SiO 2 /Si 3 N 4 /Si(100) surface acoustic wave (SAW) device has been fabricated and will be compared with standard AlN/SiO 2 -based…”
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    Journal Article
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    Contacting graphene in a 200 mm wafer silicon technology environment by Lisker, Marco, Lukosius, Mindaugas, Kitzmann, Julia, Fraschke, Mirko, Wolansky, Dirk, Schulze, Sebastian, Lupina, Grzegorz, Mai, Andreas

    Published in Solid-state electronics (01-06-2018)
    “…[Display omitted] •PECVD of silicon nitride on the graphene was used as the passivation layer.•Two approaches for producing contacts to graphene tested with…”
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    Journal Article
  6. 6

    Optical Stimulation Effects on TiO2 Sensor Dielectric Used in Capacitively-Coupled High-Density CMOS Microelectrode Array by Bertotti, Gabriel, Jetter, Florian, Keil, Stefan, Dodel, Normal, Schreiter, Matthias, Wolansky, Dirk, Boucsein, Clemens, Boven, Karl-Heinz, Zeck, Gunther, Thewes, Roland

    Published in IEEE electron device letters (01-07-2017)
    “…The effect of optical stimulation of neural tissue is considered in capacitively coupled CMOS microelectrode arrays used for in vitro extracellular recording…”
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    Journal Article
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    SiGe p-n-p HBTs With 265-GHz f max, 175-GHz f T, and 3.65-ps Gate Delay by Heinemann, Bernd, Rucker, Holger, Barth, Rainer, Drews, Jurgen, Fursenko, Oksana, Grabolla, Thomas, Kurps, Rainer, Marschmeyer, Steffen, Scheit, Alexander, Schmidt, Detlef, Trusch, Andreas, Wolansky, Dirk, Yamamoto, Yuji

    Published in IEEE electron device letters (01-08-2014)
    “…SiGe p-n-p heterojunction bipolar transistors (HBTs) are presented with f T /f max values of 175 GHz/265 GHz and a minimum current mode logic ring oscillator…”
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    Journal Article
  11. 11

    Thermal oxidation of chemical vapour deposited tungsten layers on silicon substrates for embedded non-volatile memory application by Sohal, Rakesh, Walczyk, Christian, Zaumseil, Peter, Wolansky, Dirk, Fox, Alexander, Tillack, Bernd, Müssig, Hans-Joachim, Schroeder, Thomas

    Published in Thin solid films (30-06-2009)
    “…This research is targeted to enhance the functionality of bipolar complementary metal-oxide-semiconductor by innovative concepts of embedded resistive random…”
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    Journal Article
  12. 12

    Wide range tuning of titanium nitride sheet resistance for thin film resistors by Wolansky, Dirk

    “…In this paper, a significant extension of the Rs tuning range of sputtered titanium nitride (TiN) layers for thin film resistor (TFR) applications in a…”
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    Conference Proceeding
  13. 13

    Impact of Temperature on the Resistive Switching Behavior of Embedded hbox HfO 2 -Based RRAM Devices by Walczyk, Christian, Walczyk, Damian, Schroeder, Thomas, Bertaud, Thomas, Sowinska, Malgorzata, Lukosius, Mindaugas, Fraschke, Mirko, Wolansky, Dirk, Tillack, Bernd, Miranda, Enrique, Wenger, Christian

    Published in IEEE transactions on electron devices (01-09-2011)
    “…Back-end-of-line integrated hbox 1 hbox 1 Unknown character mu hbox m 2 Unknown character hbox TiN / HfO 2 / break hbox Ti / TiN MIM memory devices in a 0.25-…”
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    Journal Article
  14. 14

    Impact of Temperature on the Resistive Switching Behavior of Embedded [Formula Omitted]-Based RRAM Devices by Walczyk, Christian, Walczyk, Damian, Schroeder, Thomas, Bertaud, Thomas, Sowinska, Malgorzata, Lukosius, Mindaugas, Fraschke, Mirko, Wolansky, Dirk, Tillack, Bernd, Miranda, Enrique, Wenger, Christian

    Published in IEEE transactions on electron devices (01-09-2011)
    “…Back-end-of-line integrated [Formula Omitted] MIM memory devices in a 0.25-[Formula Omitted] complementary metal-oxide-semiconductor technology were built to…”
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    Journal Article
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    Development of a Through-Silicon Via (TSV) Process Module for Multi-project Wafer SiGe BiCMOS and Silicon Interposer by Wietstruck, M., Marschmeyer, S., Kulse, P., Voss, T., Lisker, M., Kruger, A., Wolansky, D., Fraschke, M., Kaynak, M.

    “…In this work, the development of a Through-Silicon Via process module for multi-project wafer SiGe BiCMOS and silicon interposer is demonstrated. The TSV…”
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    Conference Proceeding
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