Search Results - "Woehlert, S."

A reliable technology concept for active power cycling to extreme temperatures by Nelhiebel, M., Illing, R., Schreiber, C., Wöhlert, S., Lanzerstorfer, S., Ladurner, M., Kadow, C., Decker, S., Dibra, D., Unterwalcher, H., Rogalli, M., Robl, W., Herzig, T., Poschgan, M., Inselsbacher, M., Glavanovics, M., Fraissé, S.

“…We demonstrate that by novel technology concepts, silicon devices can handle electrical power pulses millions of times without failure, although peak…”
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Scratch induced thin film buckling for quantitative adhesion measurements by Kleinbichler, A., Pfeifenberger, M.J., Zechner, J., Wöhlert, S., Cordill, M.J.

“…Adhesion of thin films is one of the most important factors determining reliability of microelectronic devices and semiconductor industry requires quantitative…”
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Microstructure and stress gradients in TiW thin films characterized by 40 nm X-ray diffraction and transmission electron microscopy by Saghaeian, F., Keckes, J., Woehlert, S., Rosenthal, M., Reisinger, M., Todt, J.

“…•Investigation of two TiW films with two extreme residual stresses.•Characterization of various morphological aspects of two different TiW films.•Residual…”
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Coexistence of Metamagnetism and Slow Relaxation of the Magnetization in a Cobalt Thiocyanate 2D Coordination Network by Wöhlert, S., Boeckmann, J., Wriedt, M., Näther, Christian

“…Coexistence of metamagnetism and slow relaxation of magnetization is a very rare phenomenon, which is found in the title compound that is accessible through…”
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Annealing effects on the film stress and adhesion of tungsten-titanium barrier layers by Kleinbichler, A., Todt, J., Zechner, J., Wöhlert, S., Többens, D.M., Cordill, M.J.

“…Tungsten-titanium (WTi) alloys are important barrier materials in microelectronic devices. Thus the adhesion of WTi to silicate glass substrates influences the…”
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High temperature storage reliability investigation of the Al–Cu wire bond interface by Pelzer, R., Nelhiebel, M., Zink, R., Wöhlert, S., Lassnig, A., Khatibi, G.

“…In this study the intermetallic compound (IMC) formation of annealed 50μm copper wires, thermosonically nailhead bonded to thick Al−0.5wt.% Cu pads, was…”
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Effective and reliable heat management for power devices exposed to cyclic short overload pulses by Nelhiebel, M., Illing, R., Detzel, Th, Wöhlert, S., Auer, B., Lanzerstorfer, S., Rogalli, M., Robl, W., Decker, S., Fugger, J., Ladurner, M.

“…•We discuss the usefulness of thick copper power metal as on-chip heat sinks for thermal management.•We show that pulse duration and metal thickness must be…”
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Koexistenz von Metamagnetismus und langsamer Relaxation der Magnetisierung in einem zweidimensionalen Cobalt-Thiocyanat- Koordinationsnetzwerk by Wöhlert, S., Boeckmann, J., Wriedt, M., Näther, Christian

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Fabrication of MEMS based structures for characterization of thin metal films by nanoindentation technique by Saghaeian, F., Keckes, J., Zechner, J., Woehlert, S., Schreiber, K.A., Pfaff, H., Walter, J.

“…Micro-Electro-Mechanical systems based structures offer a reliable platform for investigating properties of thin metal film which are strongly influenced by…”
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Prediction of wafer bow through thermomechanical simulation of patterned hard coated copper films by Zarbakhsh, J., Detzel, T., Rui Huang, Leicht, M., Nelle, P., Woehlert, S.

“…Due to the large difference in the coefficients of thermal expansion of the materials used in advanced semiconductor manufacturing, the fabrication process of…”
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