Search Results - "Wocko, Andreas"

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    Study of relationship between 300 mm Si wafer surface and annealing temperatures for advanced semiconductor-based applications by Wocko, Andreas, Radovanovic, Sanda, Dighe, Prasanna

    “…Surface morphology dependence on annealing conditions is one of the most important parameters that is being monitored in current manufacturing environments…”
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    Conference Proceeding
  2. 2

    Wafer backside inspection applications in lithography by Lederer, K., Scholze, M., Strohbach, U., Wocko, A., Reuter, T., Schoenauer, A.

    “…As the Semiconductor Industry starts to ramp its 110 nm production capacity, the need for optimal uniformity across the wafer surface becomes a very important…”
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    Conference Proceeding