Search Results - "Witzman, S."

Thermo-structural behavior of underfilled flip-chips by Gektin, V., Bar-Cohen, A., Witzman, S.

“…The continuing drive towards high-density, low-profile integrated circuit packaging has accelerated the spread of flip-chip technology. The use of an area…”
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Mechanical integrity of the IC device package-a key factor in achieving failure free product performance by Witzman, S., Giroux, Y.

“…A methodology has been developed to maximize product hardware integrity and practically eliminate service affecting field failures. This methodology starts…”
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Free convection air cooling of the electronic equipment: still a miracle waiting to be explored and explained by Witzman, S., Newport, D., Nicoletta, T.

“…An experimental program was carried out to determine the temperature field created by uniform arrays of electronic devices mounted on a printed circuit board…”
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Silicon interconnect-a critical factor in device thermal management by Witzman, S., Smith, K., Metelski, G.

“…The analytical and experimental methodologies for studying silicon device degradation under electrothermal stress are investigated. The experimental data…”
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Coffin-Manson based fatigue analysis of underfilled DCAs by Gektin, Vadim, Bar-Cohen, Avram, Witzman, Sorin

“…The continuing drive toward high-density, low-profile Integrated Circuit packaging has accelerated the spread of flip-chip technology to laminated substrates,…”
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Silicon interconnect-a critical factor in device thermal management by Witzman, S., Metelski, G., Smith, K.

“…Analytical and experimental methodologies for studying silicon device degradation under electrothermal stress are discussed. The experimental data support the…”
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