Concept for performance-enhancement of ultra-precision dicing for bulk hard and brittle materials in micro applications by laser dressing

[Display omitted] ► Laser dressing simplifies the dressing process. ► Concept for high durability of metal-bonded dicing blades can be achieved with this work. ► The laser dressing concept enhances the scope of application of metal-bonded dicing blade for hard and brittle materials. ► The concept of...

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Bibliographic Details
Published in:	Microelectronic engineering Vol. 98; pp. 544 - 547
Main Authors:	Stompe, M., Witzendorff, P.v., Cvetkovic, S., Moalem, A., Stute, U., Rissing, L.
Format:	Journal Article Conference Proceeding
Language:	English
Published:	Amsterdam Elsevier B.V 01-10-2012 Elsevier
Subjects:	Advanced ceramics Applied sciences Blades Condensed matter: structure, mechanical and thermal properties Contact of materials. Friction. Wear Dicing Dressing Electronics Exact sciences and technology Laser Mechanical and acoustical properties of condensed matter Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Mechanical properties of solids Metals. Metallurgy Micro- and nanoelectromechanical devices (mems/nems) Microelectronic fabrication (materials and surfaces technology) Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Tribology and hardness Dressing Dicing Blades Laser Advanced ceramics Performance evaluation Material processing High precision Roughness Micromachine Implementation Hard material Cutting Microelectronic fabrication Resins Ceramic materials Microelectromechanical device Metallic bond Hostile environment Brittle material Diamond Silicon carbide Laser pulse Sintering Wear On line processing Resist
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Summary:	[Display omitted] ► Laser dressing simplifies the dressing process. ► Concept for high durability of metal-bonded dicing blades can be achieved with this work. ► The laser dressing concept enhances the scope of application of metal-bonded dicing blade for hard and brittle materials. ► The concept offers a reduction of binder diversity of ultra-precision dicing. Adapted ultra-precision dicing processes are required for implementing hard and brittle materials such as sintered silicon carbide (SSiC) into MEMS applications. Wear and accuracy loss of resin-bonded dicing blades are significant when processing SSiC. Metal-bonded dicing blades can better resist the harsh environment during dicing of SSiC but require frequent dressing to renew the worn-out diamond grains. This paper presents laser dressing of metal-bonded dicing blades to show its capability as an online dressing tool. The laser dressed blades achieve equal sharpness as conventional dressed blades with the advantage of a smaller and more consistent reduction of the blade diameter. Laser pulse lengths of 655 and 12ps with a wavelength of 532nm are studied for laser dressing. The dicing blades dressed with 655ps achieved higher cutting performances in terms of increased substrate roughness and better cutting depth consistency.
ISSN:	0167-9317 1873-5568
DOI:	10.1016/j.mee.2012.07.033