Search Results - "Wilkinson, C.D.W."

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  1. 1

    Adhesion formation of primary human osteoblasts and the functional response of mesenchymal stem cells to 330 nm deep microgrooves by Biggs, M.J.P, Richards, R.G, McFarlane, S, Wilkinson, C.D.W, Oreffo, R.O.C, Dalby, M.J

    Published in Journal of the Royal Society interface (06-10-2008)
    “…The surface microtexture of an orthopaedic device can regulate cellular adhesion, a process fundamental in the initiation of osteoinduction and osteogenesis…”
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    Journal Article
  2. 2

    Applications of nano-patterning to tissue engineering by Gadegaard, N., Martines, E., Riehle, M.O., Seunarine, K., Wilkinson, C.D.W.

    Published in Microelectronic engineering (01-04-2006)
    “…The application of nanotechnology to biotechnology has increased over the years. One particular area which potentially could benefit from this is cell and…”
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    Journal Article Conference Proceeding
  3. 3

    Arrays of nano-dots for cellular engineering by Gadegaard, N., Thoms, S., Macintyre, D.S., Mcghee, K., Gallagher, J., Casey, B., Wilkinson, C.D.W.

    Published in Microelectronic engineering (01-06-2003)
    “…Efficient patterning of large areas with nanometre features is required for cellular engineering applications. The final product must be made at an economic…”
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    Journal Article Conference Proceeding
  4. 4

    Focal adhesion interactions with topographical structures: a novel method for immuno-SEM labelling of focal adhesions in S-phase cells by BIGGS, M.J.P, RICHARDS, R.G, WILKINSON, C.D.W, DALBY, M.J

    Published in Journal of microscopy (Oxford) (01-07-2008)
    “…Current understanding of the mechanisms involved in osseointegration following implantation of a biomaterial has led to adhesion quantification being…”
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    Journal Article
  5. 5

    A low damage Si3N4 sidewall spacer process for self-aligned sub-100nm III–V MOSFETs by Li, X., Hill, R.J.W., Zhou, H., Wilkinson, C.D.W., Thayne, I.G.

    Published in Microelectronic engineering (01-05-2008)
    “…This paper investigates a low damage reactive ion etch (RIE) process to make thin silicon nitride sidewall spacers for the fabrication of self-aligned…”
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    Journal Article
  6. 6

    Optical heating for short hot embossing cycle times by Seunarine, K., Gadegaard, N., Riehle, M.O., Wilkinson, C.D.W.

    Published in Microelectronic engineering (01-04-2006)
    “…While hot embossing of polymers is very attractive for the production of a large number of samples, press techniques can have a longer cycle time for heating…”
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    Journal Article Conference Proceeding
  7. 7

    Effective extra-cellular recording from vertebrate neurons in culture using a new type of micro-electrode array by Sandison, M, Curtis, A.S.G, Wilkinson, C.D.W

    Published in Journal of neuroscience methods (15-02-2002)
    “…We describe the fabrication and use of a new type of extracellular micro-electrode array mounted on a flexible transparent polyimide substrate that can be…”
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  8. 8

    The fabrication and magnetic properties of acicular magnetic nano-elements by Ruhrig, M., Khamsehpour, B., Kirk, K.J., Chapman, J.N., Aitchison, P., McVitie, S., Wilkinson, C.D.W.

    Published in IEEE transactions on magnetics (01-09-1996)
    “…Two different lithographic techniques have been developed for fabricating magnetic nano-elements on ultra-thin electron-transparent substrates thereby allowing…”
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  9. 9

    The use of nanoscale topography to modulate the dynamics of adhesion formation in primary osteoblasts and ERK/MAPK signalling in STRO-1+ enriched skeletal stem cells by Biggs, Manus J.P, Richards, R. Geoff, Gadegaard, Nikolaj, Wilkinson, Chris D.W, Oreffo, Richard O.C, Dalby, Matthew J

    Published in Biomaterials (01-10-2009)
    “…Abstract The physiochemical characteristics of a material with in vivo applications are critical for the clinical success of the implant and regulate both…”
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    Journal Article
  10. 10

    Nanoscale embossing of polymers using a thermoplastic die by Casey, B.G., Cumming, D.R.S., Khandaker, I.I., Curtis, A.S.G., Wilkinson, C.D.W.

    Published in Microelectronic engineering (01-05-1999)
    “…In this paper we present a novel mechanical pattern transfer process where direct written perspex substrates are used as the master dies for embossing. Using…”
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    Journal Article Conference Proceeding
  11. 11

    Regulation of implant surface cell adhesion: characterization and quantification of S-phase primary osteoblast adhesions on biomimetic nanoscale substrates by Biggs, Manus J.P., Richards, R.G., Gadegaard, N., Wilkinson, C.D.W., Dalby, M.J.

    Published in Journal of orthopaedic research (01-02-2007)
    “…Integration of an orthopedic prosthesis for bone repair must be associated with osseointegration and implant fixation, an ideal that can be approached via…”
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    Journal Article
  12. 12

    Simultaneous multisite recordings and stimulation of single isolated leech neurons using planar extracellular electrode arrays by Wilson, R J, Breckenridge, L, Blackshaw, S E, Connolly, P, Dow, J A, Curtis, A S, Wilkinson, C D

    Published in Journal of neuroscience methods (01-07-1994)
    “…Planar extracellular electrode arrays provide a non-toxic, non-invasive method of making long-term, multisite recordings with moderately high spatial frequency…”
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    Journal Article
  13. 13

    Short-channel effects and drain-induced barrier lowering in nanometer-scale GaAs MESFET's by Adams, J.A., Thayne, I.G., Wilkinson, C.D.W., Beaumont, S.P., Johnson, N.P., Kean, A.K., Stanley, C.R.

    Published in IEEE transactions on electron devices (01-06-1993)
    “…Short-channel effects in GaAs MESFETs are investigated. MESFETs were fabricated with gate lengths in the range of 40 to 300 nm with GaAs and AlGaAs buffer…”
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  14. 14

    Substratum nanotopography and the adhesion of biological cells. Are symmetry or regularity of nanotopography important? by Curtis, A.S.G, Casey, B, Gallagher, J.O, Pasqui, D, Wood, M.A, Wilkinson, C.D.W

    Published in Biophysical chemistry (25-12-2001)
    “…Animal cells live in environments where many of the features that surround them are on the nanoscale, for example detail on collagen molecules. Do cells react…”
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  15. 15

    Biodegradable polymer tubes with lithographically controlled 3D micro- and nanotopography by Seunarine, K., Meredith, D.O., Riehle, M.O., Wilkinson, C.D.W., Gadegaard, N.

    Published in Microelectronic engineering (01-05-2008)
    “…We introduce a novel scaffold fabrication process for making tubular constructs for vascular tissue engineering. Every aspect of the scaffold has been…”
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    Journal Article Conference Proceeding
  16. 16

    Dry etching of a device quality high-k Ga x Gd y O z gate oxide in CH 4/H 2–O 2 chemistry for the fabrication of III–V MOSFETs by Li, X., Zhou, H., Hill, R.J.W., Wilkinson, C.D.W., Thayne, I.G.

    Published in Microelectronic engineering (2007)
    “…This paper investigates the reactive ion etching of Ga x Gd y O z , a device quality high-k gate oxide for the fabrication of III–V metal-oxide-semiconductor…”
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    Journal Article
  17. 17

    Very high resolution etching of magnetic nanostructures in organic gases by Kong, X., Krása, D., Zhou, H.P., Williams, W., McVitie, S., Weaver, J.M.R., Wilkinson, C.D.W.

    Published in Microelectronic engineering (01-05-2008)
    “…Two methods for high resolution dry etching of permalloy (NiFe) and iron (Fe) nanostructures are presented and discussed. The first involves the use of carbon…”
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    Journal Article Conference Proceeding
  18. 18

    Pattern transfer of a 23 nm-period grating and sub-15 nm dots into CVD diamond by Lister, K.A., Casey, B.G., Dobson, P.S., Thoms, S., Macintyre, D.S., Wilkinson, C.D.W., Weaver, J.M.R.

    Published in Microelectronic engineering (01-06-2004)
    “…We have made 23 nm period gratings (11.5 nm 1:1 lines and spaces) on diamond substrates using hydrogen silsesquioxane (HSQ) as a resist for electron beam…”
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  19. 19

    Low temperature high density Si 3N 4 MIM capacitor technology for MMMIC and RF-MEMs applications by Elgaid, K., Zhou, H., Wilkinson, C.D.W., Thayne, I.G.

    Published in Microelectronic engineering (2004)
    “…In this work, a novel, high quality, high-density, deposited at room temperature ultra thin 5 nm Si 3N 4 metal insulator metal (MIM) capacitor process for…”
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  20. 20

    30 nm Tungsten gates etched by a low damage ICP etching for the fabrication of compound semiconductor transistors by Li, X., Cao, X., Zhou, H., Wilkinson, C.D.W., Thoms, S., Macintyre, D., Holland, M., Thayne, I.G.

    Published in Microelectronic engineering (01-04-2006)
    “…This paper investigates high resolution, low damage dry etching of tungsten, a suitable candidate for gate metallization in compound semiconductor based high…”
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    Journal Article Conference Proceeding