Search Results - "Wiemer, Maik"

Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing by Seifert, Tobias, Sowade, Enrico, Roscher, Frank, Wiemer, Maik, Gessner, Thomas, Baumann, Reinhard R

“…We report about a detailed comparison of the additive manufacturing methods inkjet printing (IJP) and aerosol jet printing (AJP). Both technologies are based…”
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Process Development of Aluminum Electroplating from an Ionic Liquid on 150 mm Wafer Level by Braun, Silvia, Wiemer, Maik, Schulz, Stefan E

“…This paper focuses on the development of electroplating on 150 mm wafer level for microsystem technology applications from 1-Ethyl-3-methylimidazolium chloride…”
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Impact of Non-Accelerated Aging on the Properties of Parylene C by Selbmann, Franz, Scherf, Christina, Langenickel, Jörn, Roscher, Frank, Wiemer, Maik, Kuhn, Harald, Joseph, Yvonne

“…The polymer Parylene combines a variety of excellent properties and, hence, is an object of intensive research for packaging applications, such as the direct…”
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Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates by Selbmann, Franz, Paul, Soumya Deep, Satwara, Maulik, Roscher, Frank, Wiemer, Maik, Kuhn, Harald, Joseph, Yvonne

“…Emerging trends like the Internet of Things require an increasing number of different sensors, actuators and electronic devices. To enable new applications,…”
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Aluminum Patterned Electroplating from AlCl₃⁻[EMIm]Cl Ionic Liquid towards Microsystems Application by Al Farisi, Muhammad Salman, Hertel, Silvia, Wiemer, Maik, Otto, Thomas

“…Electroplating process is being used to deposit a relatively thick film of metallic materials for various microsystems applications, such as for the…”
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Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils by Hofmann, Christian, Satwara, Maulik, Kroll, Martin, Panhale, Sushant, Rochala, Patrick, Wiemer, Maik, Hiller, Karla, Kuhn, Harald

“…Considering the demand for low temperature bonding in 3D integration and packaging of microelectronic or micromechanical components, this paper presents the…”
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Investigation of biocompatible Parylene as triboelectric layer for wearable energy harvesting by Selbmann, Franz, Baum, Mario, Bobinger, Marco, Gottwald, Markus, Wiemer, Maik, Kuhn, Harald

“…Triboelectric nanogenerators (TENGs) are energy converters or energy harvesters that convert mechanical motion into electrical energy on the basis of their…”
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Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical Components by Bargiel, Sylwester, Baranski, Maciej, Wiemer, Maik, Frömel, Jörg, Wang, Wei-Shan, Gorecki, Christophe

“…We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning…”
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Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding by Tanaka, Koki, Wang, Wei-Shan, Baum, Mario, Froemel, Joerg, Hirano, Hideki, Tanaka, Shuji, Wiemer, Maik, Otto, Thomas

“…To increase the yield of the wafer-level Cu-Cu thermo-compression bonding method, certain surface pre-treatment methods for Cu are studied which can be exposed…”
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Aluminum–germanium wafer bonding of (AlGaIn)N thin-film light-emitting diodes by Goßler, Christian, Kunzer, Michael, Baum, Mario, Wiemer, Maik, Moser, Rüdiger, Passow, Thorsten, Köhler, Klaus, Schwarz, Ulrich T., Wagner, Joachim

“…Eutectic aluminum–germanium wafer bonding was used to fabricate (AlGaIn)N thin-film light-emitting diodes (LEDs). Wafer bonding was carried out on 2″ wafer…”
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Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging by Hofmann, Christian, Kroll, Martin, Panhale, Sushant, Wiemer, Maik, Kunke, Andreas, Hiller, Karla, Kuhn, Harald

“…This paper presents a technique for selective and energy-efficient induction heating of aluminum (Al) frames to support and enhance the thermocompression…”
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Low-Temperature Wafer Bonding Using Solid-Liquid Inter-Diffusion Mechanism by Froemel, Joerg, Baum, Mario, Wiemer, Maik, Gessner, Thomas

“…The low temperature joining of semiconductor substrates on wafer level by solid-liquid inter-diffusion bonding using the Cu/Ga and Au/In systems is…”
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Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers by Vogel, K., Wuensch, D., Shaporin, A., Mehner, J., Billep, D., Wiemer, M.

“…Wafer bonding describes all technologies for joining two or more substrates directly or using certain intermediate layers. Current investigations are focused…”
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Aerosol Jet Printing of Nano Particle Based Electrical Chip Interconnects by Seifert, Tobias, Baum, Mario, Roscher, Frank, Wiemer, Maik, Gessner, Thomas

“…Mask less fabricated 3D interconnects may have a big potential in future microelectronic applications by enhancing freedom of device design or power- and…”
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Wafer-Level Fabrication of Microcube-Typed Beam-Splitters by Saw-Dicing of Glass Substrate by Baranski, Maciej, Bargiel, Sylwester, Passilly, Nicolas, Guichardaz, Blandine, Herth, Etienne, Gorecki, Christophe, Chenping Jia, Fromel, Jorg, Wiemer, Maik

“…This letter reports on the development of an integrated micro-optical beam splitter that can be array-arranged. The proposed wafer-level fabrication, based on…”
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Wafer-level fabrication of micro Cube-typed beam-splitters by saw-dicing of glass substrates by Baranski, Maciej, Bargiel, Sylwester, Passilly, Nicolas, Guichardaz, Blandine, Herth, Etienne, Gorecki, Christophe, Chenping, Jia, Frömel, Jörg, Wiemer, Maik

“…This letter reports on the development of an integrated micro-optical beam splitter that can be array-arranged. The proposed wafer-level fabrication, based on…”
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Micromachined phase-shifted array-type Mirau interferometer for swept-source OCT imaging: design, microfabrication and experimental validation by Gorecki, C, Lullin, J, Perrin, S, Bargiel, S, Albero, J, Gaiffe, O, Rutkowski, J, Cote, J M, Krauter, J, Osten, W, Wang, W-S, Weimer, M, Froemel, J

“…OCT instruments permit fast and non-invasive 3D optical biopsies of biological tissues. However, they are bulky and expensive, making them only affordable at…”
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Aluminum-Aluminum Wafer Level Thermo Compression Bonding Using Thick Electroplated Aluminum Bonding Frames by Braun, Silvia, Cirulis, Imants, Vogel, Klaus, Hofmann, Christian, Wiemer, Maik

“…Wafer bonding is crucial in semiconductor manufacturing, integrating diverse materials and creating complex devices. Aluminum thermo-compression bonding (Al…”
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Advances in Parylene Adhesive Bonding for the Realization of Biocompatible Microsystems by Selbmann, Franz, Roscher, Frank, Wiemer, Maik, Kuhn, Harald, Joseph, Yvonne

“…Wafer to wafer and chip to wafer bonding technologies are a key enabling processes for the fabrication of microsystems. The presented paper focuses on the…”
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Aluminum―germanium wafer bonding of (AlGaIn)N thin-film light-emitting diodes : WaferBond'11, International Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration by GOBLER, Christian, KUNZER, Michael, BAUM, Mario, WIEMER, Maik, MOSER, Rüdiger, PASSOW, Thorsten, KÖHLER, Klaus, SCHWARZ, Ulrich T, WAGNER, Joachim

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