Search Results - "Wesolek, D.M."

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  1. 1

    Wafer Scale Integration Enabling Space Science by Wesolek, D.M., Darrin, M.A.G., Osiander, R.

    Published in 2008 IEEE Aerospace Conference (2008)
    “…Wafer scale integration enables the ability to miniaturize space craft instrument builds. We use the term wafer scale to indicate a packaging concept where the…”
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    Conference Proceeding Journal Article
  2. 2

    Micro Processing a Path to Aggressive Instrument Miniaturization for Micro and Picosats by Wesolek, D.M., Darrin, A.G., Osiander, R., Lehtonen, S.J., Edwards, R.L., Hererro, F.A.

    Published in 2005 IEEE Aerospace Conference (2005)
    “…Advanced micro-fabrication and packaging techniques provided through microelectromechanical systems (MEMS) technology enable fabrication and system integration…”
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    Conference Proceeding